Inventor · disambiguated record
Che-Jung Chang
Also filed as: CHANG CHE JUNG
11 granted patents·1 pending application·62 citations·filing 2001–2023
84Inventor score
Files withHTC CORP5SILICONWARE PRECISION INDUSTRIES CO LTD3CHANG CHE-JUNG2DELL PRODUCTS LP1SANDISK CORP1
Top patents by PatentIndex Score
12 records- 0190US6548911B2Multimedia chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 15, 2003·56 cites·10 claims
- 0288US11991859B2Apparatus for direct contact heat pipeDELL PRODUCTS LP·Filed 2022·Granted May 21, 2024·2 cites·18 claims
- 0365US7615861B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsSANDISK CORP·Filed 2006·Granted Nov 10, 2009·2 cites·9 claims
- 0457US11259400B1Circuit boardHTC CORP·Filed 2020·Granted Feb 22, 2022·0 cites·5 claims
- 0554US12426151B2Circuit board and layout method thereofHTC CORP·Filed 2023·Granted Sep 23, 2025·0 cites·16 claims
- 0654US11451207B1Common mode filterHTC CORP·Filed 2021·Granted Sep 20, 2022·0 cites·9 claims
- 0752US11419205B1Circuit board structure and layout structure thereofHTC CORP·Filed 2021·Granted Aug 16, 2022·0 cites·9 claims
- 0851US8482139B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsCHANG CHE-JUNG·Filed 2009·Granted Jul 9, 2013·0 cites·12 claims
- 0951US8232145B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsCHANG CHE-JUNG·Filed 2009·Granted Jul 31, 2012·0 cites·16 claims
- 1049US11700689B2Circuit boardHTC CORP·Filed 2021·Granted Jul 11, 2023·0 cites·7 claims
- 1146US6541307B2Multimedia chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Apr 1, 2003·2 cites·15 claims
- 1236US2002093091A1Method of fabricating a ground-ball bonding structure without trapped air for tape ball grid array applicationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →