Inventor · disambiguated record
Chun-Wei Chang
Also filed as: CHANG CHUN-WEI
112 granted patents·56 pending applications·440 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD56CHANG CHUN-WEI13EPISTAR CORP12P TWO IND INC12MEDIATEK INC11
Top patents by PatentIndex Score
168 records- 0198US9875892B2Method of forming a photoresist layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·70 cites·20 claims
- 0297US9028915B2Method of forming a photoresist layerCHANG CHUN-WEI·Filed 2012·Granted May 12, 2015·111 cites·16 claims
- 0396US11456750B2Phase-locked loop circuit having linear voltage-domain time-to-digital converter with output subrangeMEDIATEK INC·Filed 2021·Granted Sep 27, 2022·10 cites·19 claims
- 0496US11288437B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·4 cites·20 claims
- 0595US10121811B1Method of high-aspect ratio pattern formation with submicron pixel pitchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 6, 2018·12 cites·20 claims
- 0695US6933316B2Indole compoundsNAT HEALTH RESEARCH INSTITUTES·Filed 2002·Granted Aug 23, 2005·53 cites·39 claims
- 0794US11714454B1Head-mounted display device and wearable assemblyHTC CORP·Filed 2022·Granted Aug 1, 2023·5 cites·16 claims
- 0894US11616124B2Method of making fin field effect transistor (FinFET) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·2 cites·15 claims
- 0992US10867109B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·6 cites·20 claims
- 1092US10558052B2Adjusting mechanism and head mounted displayHTC CORP·Filed 2018·Granted Feb 11, 2020·15 cites·12 claims
- 1192US10032869B2Fin field effect transistor (FinFET) device having position-dependent heat generation and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·6 cites·18 claims
- 1292US7528165B2Indole compoundsNAT HEALTH RESEARCH INSTITUTES·Filed 2005·Granted May 5, 2009·13 cites·18 claims
- 1390US11978511B2Phase-change memory cell and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·2 cites·20 claims
- 1490US10090357B2Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forcesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·5 cites·20 claims
- 1590US9768227B2Light-emitting element having a plurality of light-emitting structuresEPISTAR CORP·Filed 2014·Granted Sep 19, 2017·8 cites·17 claims
- 1690US9652001B2Carrier for hard disk driveHON HAI PREC IND CO LTD·Filed 2015·Granted May 16, 2017·10 cites·11 claims
- 1790US7632955B2Indole compoundsNAT HEALTH RESEARCH INSTITUTES·Filed 2005·Granted Dec 15, 2009·10 cites·7 claims
- 1889US11835725B2Head-mounted display device assembly and external adjustment moduleHTC CORP·Filed 2022·Granted Dec 5, 2023·2 cites·18 claims
- 1989US10797091B2Semiconductor imaging device having improved dark current performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 2089US10546889B2Method of high-aspect ratio pattern formation with submicron pixel pitchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·5 cites·20 claims
- 2187US11742604B2Easy lock connector with unlock structureP TWO IND INC·Filed 2022·Granted Aug 29, 2023·2 cites·10 claims
- 2286US11658031B2Implantation mask formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·1 cites·20 claims
- 2386US10734436B2Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forcesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·3 cites·20 claims
- 2485US2024394462A1Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2584US11381169B2Power supply unit with auxiliary boost control in bootloader modeASTEC INT LTD·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 2684US9589803B2Gate electrode of field effect transistorCHEN NENG-KUO·Filed 2012·Granted Mar 7, 2017·4 cites·20 claims
- 2783US10919128B2Modular side-by-side vise structureCHANG CHUN WEI·Filed 2018·Granted Feb 16, 2021·3 cites·9 claims
- 2883US10186542B1Patterning for substrate fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·3 cites·20 claims
- 2983US8289690B2Expansion card retention assembly and computer incorporating the sameCHANG CHUN-WEI·Filed 2010·Granted Oct 16, 2012·10 cites·20 claims
- 3082US12349268B2Package componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 3182US12099792B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 3282US9812551B2Method of forming the gate electrode of field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 7, 2017·2 cites·20 claims
- 3382US9263252B2Method of protecting an interlayer dielectric layer and structure formed therebyCHANG CHUN-WEI·Filed 2013·Granted Feb 16, 2016·5 cites·20 claims
- 3481US10930701B2Light-emitting element having a plurality of light-emitting structuresEPISTAR CORP·Filed 2019·Granted Feb 23, 2021·1 cites·12 claims
- 3581US9627326B2Method for forming alignment marks and structure of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·2 cites·20 claims
- 3681US9466909B1ConnectorHTC CORP·Filed 2015·Granted Oct 11, 2016·7 cites·10 claims
- 3781US2025318327A1Semiconductor deviceEPISTAR CORP·Filed 2025·Application pending·0 cites
- 3881US2025292832A1Phase-change memory cell and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3980US12293940B2Techniques for forming a deep trench isolation structure between photodiodes by forming a first set of trenches based on a first pattern and forming a second set of trenches based on a second patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 4080US12100592B2Implantation mask formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 4180US8270173B2Electronic device with locking moduleCHANG CHUN-WEI·Filed 2009·Granted Sep 18, 2012·11 cites·16 claims
- 4279US11327322B1Head mounted display deviceHTC CORP·Filed 2021·Granted May 10, 2022·1 cites·12 claims
- 4379US2025358995A1Sram device for fpga applicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4478US12040336B2Semiconductor imaging device having improved dark current performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 4578US11077531B2Fixture block composite structure for workpiece positioningCHANG CHUN WEI·Filed 2018·Granted Aug 3, 2021·2 cites·9 claims
- 4678US2024379357A1Implantation mask formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4778US2024313010A1Semiconductor imaging device having improved dark current performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4878US2025364418A1Graphene-clad metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4977US10162414B2Wireless control device, position calibrator and accessoryHTC CORP·Filed 2016·Granted Dec 25, 2018·3 cites·24 claims
- 5077US9285677B2Lithography process on high topology featuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·2 cites·20 claims
Showing the top 50 of 168 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →