Inventor · disambiguated record
Chi-Wen Chang
Also filed as: CHANG CHI-WEN
30 granted patents·6 pending applications·202 citations·filing 1992–2024
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19TAIWAN SEMICONDUCTOR MFG6ADVANCED SEMICONDUCTOR ENG2WISTRON CORP2AIC INC1
Top patents by PatentIndex Score
36 records- 0196US9335624B2Multi-patterning system and method using pre-coloring or locked patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 10, 2016·17 cites·19 claims
- 0296US8701055B1Macro cell based process design kit for advanced applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Apr 15, 2014·44 cites·20 claims
- 0386US9390218B2Integrated circuit design system with color-coded component loading estimate displayTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 12, 2016·9 cites·20 claims
- 0486US5396584AMulti-bit image edge enhancement method and apparatusDESTINY TECHNOLOGY CORP·Filed 1992·Granted Mar 7, 1995·104 cites·38 claims
- 0582US10685161B2Region based shrinking methodology for integrated circuit layout migrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 16, 2020·2 cites·20 claims
- 0681US9367654B2Variation modelingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·3 cites·20 claims
- 0781US7141867B2Quad flat non-leaded packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Nov 28, 2006·10 cites·15 claims
- 0880US9748228B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 29, 2017·3 cites·22 claims
- 0977US10910365B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 1077US9773089B2Integrated circuit design method and system with color-coded componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·2 cites·20 claims
- 1175US10943052B2Integrated circuit design method, system and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·1 cites·20 claims
- 1273US11532613B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 1371US12505272B2Region based shrinking methodology for integrated circuit layout migrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1471US9355205B2Method and apparatus of a three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·2 cites·20 claims
- 1569US11170150B2Method for making a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 1669US9213797B2Method, system and computer program product for designing semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 15, 2015·1 cites·11 claims
- 1767US11455453B2Integrated circuit design method, system and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 27, 2022·0 cites·20 claims
- 1867US2024379555A1Methods for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1966US11275880B2Region based shrinking methodology for integrated circuit layout migrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 2064US10540475B2System for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·20 claims
- 2164US8526752B2Imaging systems with fixed output sizes and frame ratesLIN SHENG·Filed 2010·Granted Sep 3, 2013·2 cites·19 claims
- 2263US10095827B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 9, 2018·0 cites·20 claims
- 2363US9129082B2Variation factor assignmentTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 8, 2015·1 cites·20 claims
- 2458US10763253B2Structure and method for cooling three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·20 claims
- 2558US9934352B2Method and system for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·0 cites·20 claims
- 2657US12293970B2Semiconductor structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 6, 2025·0 cites·20 claims
- 2755US2013342430A1Color sequential image method and system thereofWISTRON CORP·Filed 2012·Application pending·0 cites
- 2854US10170059B2Color sequential image method and system thereofWISTRON CORP·Filed 2016·Granted Jan 1, 2019·0 cites·6 claims
- 2950US10157252B2Method and apparatus of a three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·0 cites·20 claims
- 3050US9934732B2Display method and display deviceAU OPTRONICS CORP·Filed 2016·Granted Apr 3, 2018·0 cites·18 claims
- 3149US11062644B2Display deviceE INK HOLDINGS INC·Filed 2018·Granted Jul 13, 2021·0 cites·8 claims
- 3248US2023237234A1Integrated circuit design method, system and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3340US2016179726A1Programming hardware registers using a pipelined register bus, and related methods, systems, and apparatusesQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3438US2015113263A1Method for updating basic input/output system of serverAIC INC·Filed 2013·Application pending·0 cites
- 3538US2005218499A1Method for manufacturing leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 3631US8957506B2Quad flat non-leaded packageHSU YUEH-LIANG·Filed 2009·Granted Feb 17, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →