Inventor · disambiguated record
Chih-Hao Chang
Also filed as: CHANG CHIH-HAO
161 granted patents·83 pending applications·1,847 citations·filing 1995–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD82INNOLUX CORP17CHANG CHIH-HAO14TAIWAN SEMICONDUCTOR MFG13QUANTA COMP INC10
Top patents by PatentIndex Score
244 records- 0199US8703565B2Bottom-notched SiGe FinFET formation using condensationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 22, 2014·207 cites·19 claims
- 0299US8367498B2Fin-like field effect transistor (FinFET) device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 5, 2013·267 cites·19 claims
- 0398US8686516B2Silicide formation and associated devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 1, 2014·367 cites·20 claims
- 0498US8497528B2Method for fabricating a strained structureLEE TSUNG-LIN·Filed 2010·Granted Jul 30, 2013·241 cites·19 claims
- 0597US11158576B2Package structure having redistribution layer structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·4 cites·20 claims
- 0697US8623728B2Method for forming high germanium concentration SiGe stressorCHANG CHIH-HAO·Filed 2010·Granted Jan 7, 2014·38 cites·20 claims
- 0797US8395195B2Bottom-notched SiGe FinFET formation using condensationCHANG CHIH-HAO·Filed 2010·Granted Mar 12, 2013·59 cites·19 claims
- 0897US8338259B2Semiconductor device with a buried stressorWU ZHIQIANG·Filed 2010·Granted Dec 25, 2012·31 cites·6 claims
- 0996US9564529B2Method for fabricating a strained structure and structure formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·10 cites·20 claims
- 1096US8946828B2Semiconductor device having elevated structure and method of manufacturing the sameSUN SEY-PING·Filed 2010·Granted Feb 3, 2015·83 cites·15 claims
- 1196US8662731B2Foldable backlit display and device having the sameWANG YI-KAI·Filed 2011·Granted Mar 4, 2014·53 cites·20 claims
- 1295US11848363B2Method for forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 19, 2023·3 cites·20 claims
- 1395US10203795B2Touch display panel and driving method of touch modeINNOLUX CORP·Filed 2016·Granted Feb 12, 2019·14 cites·17 claims
- 1495US9324866B2Structure and method for transistor with line end extensionYU SHAO-MING·Filed 2012·Granted Apr 26, 2016·30 cites·15 claims
- 1595US9147594B2Method for fabricating a strained structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 29, 2015·13 cites·20 claims
- 1695US8833999B2Electronic device having a flexible screen, a backlight module and a light guide plateWANG YI-KAI·Filed 2012·Granted Sep 16, 2014·28 cites·10 claims
- 1795US7084345B1Slide cover unitKINPO ELECT INC·Filed 2005·Granted Aug 1, 2006·52 cites·12 claims
- 1894US10741654B2Semiconductor device and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 11, 2020·9 cites·20 claims
- 1994US10319832B2FinFET device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·9 cites·20 claims
- 2094US9190417B2Fin-like field effect transistor (FinFET) device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 17, 2015·13 cites·20 claims
- 2193US12002768B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 2293US11374136B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 2393US9947756B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·11 cites·20 claims
- 2493US9660082B2Integrated circuit transistor structure with high germanium concentration SiGe stressorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·11 cites·16 claims
- 2593US8727601B2Display for electronic deviceWANG YI-KAI·Filed 2011·Granted May 20, 2014·17 cites·28 claims
- 2693US8466027B2Silicide formation and associated devicesCHEN HUNG-MING·Filed 2011·Granted Jun 18, 2013·16 cites·9 claims
- 2792US11382233B2Removable lever for inserting and removing a tray from a chassis module of a server rackQUANTA COMP INC·Filed 2020·Granted Jul 5, 2022·5 cites·11 claims
- 2892US11282920B2Semiconductor device with air gap on gate structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·6 cites·20 claims
- 2992US9870997B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·6 cites·20 claims
- 3092US9166022B2Fin-like field effect transistor (FinFET) device and method of manufacturing sameXU JEFF J·Filed 2010·Granted Oct 20, 2015·13 cites·20 claims
- 3191US10522653B2Gate spacer structure of FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 31, 2019·5 cites·20 claims
- 3291US8551841B2IO ESD device and methods for forming the sameLEE TUNG YING·Filed 2012·Granted Oct 8, 2013·12 cites·12 claims
- 3390US11018242B2Gate spacer structure of FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 25, 2021·2 cites·20 claims
- 3490US10684634B1Method and system for compensating for temperature rise effectsQUANTA COMP INC·Filed 2019·Granted Jun 16, 2020·9 cites·18 claims
- 3590US10269907B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 3690US7915414B2Blue-emitting organometallic complexes and their applicationCHI YUN·Filed 2007·Granted Mar 29, 2011·10 cites·22 claims
- 3790US2025359263A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3889US12356674B2Method for fabricating a strained structure and structure formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 3987US11322474B2Semiconductor packageREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted May 3, 2022·2 cites·14 claims
- 4086US8754486B2IO ESD device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 17, 2014·7 cites·17 claims
- 4185US9659896B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·4 cites·20 claims
- 4285US9413270B2Single-phase three-wire power control system and power control method thereforLITE ON ELECTRONICS GUANGZHOU LTD·Filed 2015·Granted Aug 9, 2016·8 cites·10 claims
- 4384US12433002B2Method for forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 4484US10811517B2Gate spacer structure of finFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 4584US10031363B2Touch display deviceINNOLUX CORP·Filed 2016·Granted Jul 24, 2018·2 cites·17 claims
- 4683US12381163B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 4783US12218239B2Structure and method for providing line end extensions for fin-type active regionsMOSAID TECH INCORPORATED·Filed 2023·Granted Feb 4, 2025·0 cites·16 claims
- 4883US10468408B2Fin-like field effect transistor (FinFET) device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 4983US10366989B2Semiconductor device having a contact bar over an S/D structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·20 claims
- 5082US9917192B2Structure and method for transistors with line end extensionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·3 cites·19 claims
Showing the top 50 of 244 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →