Inventor · disambiguated record
Chia-Shuai Chang
Also filed as: CHANG CHIA-SHUAI
18 granted patents·9 pending applications·14 citations·filing 2006–2023
88Inventor score
Files withTONG HSING ELECTRONIC INDUSTRIES LTD16KINGPAK TECH INC6IMPAC TECHNOLOGY CO LTD4CHANG CHIA-SHUAI1
Top patents by PatentIndex Score
27 records- 0193US11764240B2Method of manufacturing image sensing chip package structure including an adhesive loopTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Sep 19, 2023·2 cites·4 claims
- 0291US12108517B2Sensor lens assembly having non-soldering configurationKINGPAK TECH INC·Filed 2022·Granted Oct 1, 2024·2 cites·16 claims
- 0388US11411029B2Image sensing chip package structure including adhesive loopTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2020·Granted Aug 9, 2022·2 cites·8 claims
- 0470US2023395624A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0569US7388192B2Image sensing module and process for packaging the sameIMPAC TECHNOLOGY CO LTD·Filed 2006·Granted Jun 17, 2008·7 cites·11 claims
- 0661US12177996B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 0760US12490541B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 2, 2025·0 cites·12 claims
- 0855US12189152B2Sensor lens assemblyTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Jan 7, 2025·0 cites·9 claims
- 0953US9892302B2Fingerprint sensing device and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2016·Granted Feb 13, 2018·1 cites·36 claims
- 1052US11792497B2Sensor lens assembly having non-reflow configurationKINGPAK TECH INC·Filed 2022·Granted Oct 17, 2023·0 cites·9 claims
- 1152US11744010B2Sensor lens assembly having non-reflow configurationKINGPAK TECH INC·Filed 2022·Granted Aug 29, 2023·0 cites·10 claims
- 1252US11723147B2Sensor lens assembly having non-reflow configurationKINGPAK TECH INC·Filed 2022·Granted Aug 8, 2023·0 cites·11 claims
- 1351US12482737B2Intelligent power module package structure and hybrid ceramic boardTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Nov 25, 2025·0 cites·12 claims
- 1450US12376399B2Sensor package structureKINGPAK TECH INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1550US12256573B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1649US2024128291A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1749US2024337779A1Optical deviceTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1848US2024304461A1Ceramic submount for semiconductor device and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1947US10867158B2Process for making a fingerprint sensor package module and the fingerprint sensor package module made therebyTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2019·Granted Dec 15, 2020·0 cites·11 claims
- 2046US11502020B2Electronic device having a chip package moduleTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2020·Granted Nov 15, 2022·0 cites·14 claims
- 2146US2008308889A1Image sensing module and method for packaging the sameCHANG CHIA-SHUAI·Filed 2008·Application pending·0 cites
- 2244US12500092B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Dec 16, 2025·0 cites·7 claims
- 2344US12174446B2Sensor lens assembly having non-soldering configurationKINGPAK TECH INC·Filed 2022·Granted Dec 24, 2024·0 cites·10 claims
- 2441US2008099866A1Image sensing module and method for packaging the sameIMPAC TECHNOLOGY CO LTD·Filed 2006·Application pending·0 cites
- 2541US2024032204A1Method for manufacturing conductive circuit board and conductive circuit board made therefromTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
- 2637US2010025793A1Assembly for image sensing chip and assembling method thereofIMPAC TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 2731US2008087975A1Chip package and chip packaging methodIMPAC TECHNOLOGY CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →