Inventor · disambiguated record
Chu-Chia Chang
Also filed as: CHANG CHU · CHANG CHU-CHIA
2 granted patents·3 pending applications·59 citations·filing 1992–2024
62Inventor score
Top patents by PatentIndex Score
5 records- 0177US5181699AImpact absorberCHANG CHU·Filed 1992·Granted Jan 26, 1993·54 cites·3 claims
- 0263US7112886B2Packaging structure with a plurality of drill holes formed directly below an underfill layerPIXART IMAGING INC·Filed 2005·Granted Sep 26, 2006·5 cites·12 claims
- 0359US2023134332A1Leadframe package with metal interposerMEDIATEK INC·Filed 2022·Application pending·0 cites
- 0456US2024347479A1Semiconductor package having moisture passing gap in power or ground metal plane of a package substrateMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0549US2022328382A1Grid array type lead frame packageMEDIATEK INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →