Inventor · disambiguated record
Chiang-Cheng Chang
Also filed as: CHANG CHIANG-CHENG
11 granted patents·11 pending applications·39 citations·filing 2005–2017
87Inventor score
Top patents by PatentIndex Score
22 records- 0189US9040361B2Chip scale package with electronic component received in encapsulant, and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted May 26, 2015·13 cites·23 claims
- 0285US9812340B2Method of fabricating semiconductor package having semiconductor elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·14 claims
- 0380US8680692B2Carrier, semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Granted Mar 25, 2014·5 cites·3 claims
- 0478US10049955B2Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Aug 14, 2018·2 cites·7 claims
- 0576US8334174B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Dec 18, 2012·6 cites·9 claims
- 0671US9324585B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 26, 2016·2 cites·5 claims
- 0767US8304665B2Package substrate having landless conductive tracesCHANG CHIANG-CHENG·Filed 2008·Granted Nov 6, 2012·3 cites·12 claims
- 0865US8766456B2Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jul 1, 2014·2 cites·20 claims
- 0965US8525348B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Sep 3, 2013·2 cites·19 claims
- 1053US9899237B2Carrier, semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·0 cites·9 claims
- 1147US2013228915A1Semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Application pending·0 cites
- 1244US9041189B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted May 26, 2015·0 cites·19 claims
- 1341US2014134797A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1440US2013341774A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1539US2006049516A1Nickel/gold pad structure of semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
- 1639US2014183721A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1737US2012001328A1Chip-sized package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 1837US2012061825A1Chip scale package and method of fabricating the sameCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 1937US2012086117A1Package with embedded chip and method of fabricating the sameCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 2037US2012013006A1Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 2137US2012313243A1Chip-scale packageCHANG CHIANG-CHENG·Filed 2011·Application pending·0 cites
- 2236US2014042638A1Semiconductor package and method of fabricating the sameSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →