Inventor · disambiguated record
Chih-Chieh Chang
Also filed as: CHANG CHIH C · CHANG CHIH-CHIEH · CHANG CHIH-CHIEH GEOFF
51 granted patents·25 pending applications·237 citations·filing 1988–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD40DELL PRODUCTS LP7AU OPTRONICS CORP3MEDIATEK INC3QUANTA DISPLAY INC3
Top patents by PatentIndex Score
76 records- 0198US11362077B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 14, 2022·4 cites·20 claims
- 0298US10267990B1Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·33 cites·20 claims
- 0397US11841541B2Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 12, 2023·5 cites·20 claims
- 0496US10371893B2Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·14 cites·20 claims
- 0592US9634049B2Solid-state imaging devices with enhanced angular responseVISERA TECHNOLOGIES CO LTD·Filed 2015·Granted Apr 25, 2017·8 cites·19 claims
- 0691US10962711B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·4 cites·20 claims
- 0789USD743958SPortable information handling systemDELL PRODUCTS LP·Filed 2014·Granted Nov 24, 2015·39 cites·1 claims
- 0889US7911798B2Memory heat sink device provided with a larger heat dissipating areaCHANG CHIH-I·Filed 2008·Granted Mar 22, 2011·47 cites·3 claims
- 0987US10930628B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 1086US12100698B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 24, 2024·1 cites·20 claims
- 1185US10665560B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·3 cites·18 claims
- 1285US2025067926A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1384US12249542B2Semiconductor device structure with an interconnect structure in a dielectric layer with multiple hydrophobic layers along sidewalls of the dielectric layer, and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 1484US7656495B2Liquid crystal display panel and manufacture method thereofAU OPTRONICS CORP·Filed 2007·Granted Feb 2, 2010·11 cites·17 claims
- 1582US11830864B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 28, 2023·0 cites·20 claims
- 1682US2025308928A1Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1781US11850704B2Methods to clean chemical mechanical polishing systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1881US11113232B2Disaggregated computer systemSUPER MICRO COMPUTER INC·Filed 2018·Granted Sep 7, 2021·3 cites·15 claims
- 1980US12345935B2Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2079US11605622B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 14, 2023·0 cites·20 claims
- 2179US2024395562A1Chemical mechanical polish slurry and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2278US12300508B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2378US12174415B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 2478US11854872B2Semiconductor device structure with interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2577US2025313723A1Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2676USD725648SInformation handling system housingDELL PRODUCTS LP·Filed 2013·Granted Mar 31, 2015·22 cites·1 claims
- 2776US2024387493A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2876US2025357277A1Through Via Power Delivery Structure for Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2975US11830841B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 3075US2025291139A1Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3174US11446785B2Methods to clean chemical mechanical polishing systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 3274US2025349708A1Through-substrate-via cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3373USD1018526SInformation handling systemDELL PRODUCTS LP·Filed 2021·Granted Mar 19, 2024·5 cites·1 claims
- 3473US11460633B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 4, 2022·0 cites·20 claims
- 3573US10947414B2Compositions for use in chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·20 claims
- 3673US8982085B2Touch panelTIANJIN FUNA YUANCHUANG TECHNOLOGY CO LTD·Filed 2013·Granted Mar 17, 2015·2 cites·20 claims
- 3773US2024379421A1Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3872US12327734B2Chemical mechanical polish slurry and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 3971US11373879B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 4071US9189055B2Method for performing power consumption management, and associated apparatusYANG JEN-CHIEH·Filed 2012·Granted Nov 17, 2015·4 cites·20 claims
- 4170US7633593B2Liquid crystal panel and fabrication method thereofAU OPTRONICS CORP·Filed 2006·Granted Dec 15, 2009·3 cites·12 claims
- 4270US2025233054A1Through Via Power Delivery Structure for Stacked ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4368US11322470B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 4468US7987298B2System and method for detecting the status of a universal serial bus port of a mobile phoneCHI MEI COMM SYSTEMS INC·Filed 2009·Granted Jul 26, 2011·2 cites·10 claims
- 4568US2025118655A1Through-substrate-via cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4666US12359090B2Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 4766US12131944B2Slurry composition, semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 4866USD912661SInformation handling systemDELL PRODUCTS LP·Filed 2018·Granted Mar 9, 2021·10 cites·1 claims
- 4963US7751023B2Apparatus for rubbing alignment layer on a substrateQUANTA DISPLAY INC·Filed 2007·Granted Jul 6, 2010·2 cites·12 claims
- 5062US11417566B2Semiconductor device structure with interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·20 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →