Inventor · disambiguated record
Chia-Lun Chang
Also filed as: CHANG CHIA-LUN
32 granted patents·12 pending applications·77 citations·filing 2007–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD34ACER INC5HSIEH CHI-MING1LIU CHENG-YI1NOVATEK MICROELECTRONICS CORP1
Top patents by PatentIndex Score
44 records- 0197US11417698B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0296US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 0396US9570410B1Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·11 cites·20 claims
- 0492US11288994B2Source driver and operation method thereofNOVATEK MICROELECTRONICS CORP·Filed 2020·Granted Mar 29, 2022·3 cites·21 claims
- 0592US10157862B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 0691US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 0790US10289166B1Housing for electronic deviceACER INC·Filed 2018·Granted May 14, 2019·5 cites·15 claims
- 0887US9935067B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 3, 2018·3 cites·20 claims
- 0985US12489030B2Methods of manufacturing integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1085US11585992B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 1185US11002927B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·3 cites·20 claims
- 1285US10840199B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·2 cites·20 claims
- 1383US10269739B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·2 cites·20 claims
- 1483US2025336786A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1582US10978370B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1682US2025316500A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1781US11121089B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·3 cites·20 claims
- 1881US10535644B1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 1981US2024274589A1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2079US2025357246A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2178US12417927B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 2278US11874513B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 2378US8000520B2Apparatus and method for testing image sensor wafers to identify pixel defectsOMNIVISION TECH INC·Filed 2007·Granted Aug 16, 2011·5 cites·25 claims
- 2477US11996400B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2577US10515915B2Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 24, 2019·1 cites·20 claims
- 2675US2025308933A1Method for laser drilling process for an integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2773US11901258B2Iintegrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2872US12266673B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 2971US9786542B2Mechanisms for forming semiconductor device having isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 10, 2017·3 cites·20 claims
- 3070US11342321B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 3170US10903090B2Method of singulate a package structure using a light transmitting film on a polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 26, 2021·1 cites·20 claims
- 3270US10108295B2Input device including sensing electrodesACER INC·Filed 2017·Granted Oct 23, 2018·1 cites·10 claims
- 3370US2025204074A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3469US12368053B2Method for laser drilling process for an integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 3569US2022359356A1Fan-Out Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3667US11830746B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 3765US2023420331A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3863US10514728B2Housing for electronic deviceACER INC·Filed 2019·Granted Dec 24, 2019·0 cites·16 claims
- 3962US11664300B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 30, 2023·0 cites·20 claims
- 4051US10810848B2Electronic device equipped with anti-theft function and method for performing anti-theft managementACER INC·Filed 2019·Granted Oct 20, 2020·0 cites·18 claims
- 4144US2008194077A1Method of low temperature wafer bonding through Au/Ag diffusionUNIV NAT CENTRAL·Filed 2007·Application pending·0 cites
- 4244US2018259803A1Electronic device with touch function and operation method thereofACER INC·Filed 2017·Application pending·0 cites
- 4339US2015075960A1Touch panelHSIEH CHI-MING·Filed 2014·Application pending·0 cites
- 4435US2009146166A1Structure Applying Optical Limit Guide LayerLIU CHENG-YI·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →