Inventor · disambiguated record
Chien-Hung Chang
Also filed as: CHANG CHIEN · CHANG CHIEN-HUNG
21 granted patents·5 pending applications·62 citations·filing 2015–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26
Top patents by PatentIndex Score
26 records- 0197US12048163B2Trench gate high voltage transistor for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·2 cites·20 claims
- 0297US9812460B1NVM memory HKMG integration technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·29 cites·20 claims
- 0392US11107690B2Fin field-effect transistor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·9 cites·20 claims
- 0492US2025365964A1Trench gate high voltage transistor for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0588US10276587B2NVM memory HKMG integration technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·5 cites·20 claims
- 0687US12453096B2Trench gate high voltage transistor for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 0787US11189628B2Trench gate high voltage transistor for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·4 cites·20 claims
- 0886US9947676B2NVM memory HKMG integration technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·5 cites·20 claims
- 0983US10515977B2Boundary design to reduce memory array edge CMP dishing effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 1083US2024373626A1Array boundary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1182US12127399B2Array boundary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1279US9397112B1L-shaped capacitor in thin film storage technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 19, 2016·3 cites·18 claims
- 1378US11812616B2Trench gate high voltage transistor for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1476US12394625B2Fin field-effect transistor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1576US12256549B2Boundary design to reduce memory array edge CMP dishing effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 1675US11706914B2Method of forming an array boundary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 1774US10811426B2NVM memory HKMG integration technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·1 cites·20 claims
- 1873US11177268B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·1 cites·20 claims
- 1973US2025169076A1Boundary design to reduce memory array edge cmp dishing effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2072US2024274687A1Contact structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2168US12002867B2Contact structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 2263US11264402B2Boundary design to reduce memory array edge CMP dishing effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 2362US12310050B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 2461US11424263B2Boundary design to reduce memory array edge CMP dishing effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 2560US11211388B2Array boundfary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·20 claims
- 2650US2024055491A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →