Inventor · disambiguated record
Cheng-Ting Chen
Also filed as: CHEN CHENG · CHEN CHENG-TING
47 granted patents·12 pending applications·222 citations·filing 1999–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD31TAIWAN SEMICONDUCTOR MFG7ADVANCED SEMICONDUCTOR ENG4CHEN CHENG2CHEN CHENG-TING2
Top patents by PatentIndex Score
59 records- 0198US9263839B2System and method for an improved fine pitch jointTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·69 cites·17 claims
- 0296US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 0395US9799631B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 24, 2017·8 cites·20 claims
- 0493US8901726B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 2, 2014·14 cites·20 claims
- 0590US8440503B1Methods for performing reflow in bonding processesLIN HSIU-JEN·Filed 2011·Granted May 14, 2013·13 cites·19 claims
- 0689US9437564B2Interconnect structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·11 cites·21 claims
- 0788US11432372B2Warpage control in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 30, 2022·3 cites·20 claims
- 0888US9412689B2Semiconductor packaging structure and methodLIN CHUN-CHENG·Filed 2012·Granted Aug 9, 2016·6 cites·20 claims
- 0985US12489030B2Methods of manufacturing integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1085US11585992B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 1185US11002927B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·3 cites·20 claims
- 1284US9230935B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·5 cites·20 claims
- 1383US9373603B2Reflow process and toolTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·6 cites·18 claims
- 1482US10978370B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1582US10879203B2Stud bump structure for semiconductor package assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·3 cites·20 claims
- 1682US9768137B2Stud bump structure for semiconductor package assembliesCHEN MENG-TSE·Filed 2012·Granted Sep 19, 2017·5 cites·18 claims
- 1781US10535644B1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 1881US10512124B2Warpage control in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·2 cites·20 claims
- 1981US8674496B2System and method for fine pitch PoP structureLIN CHENG-CHUNG·Filed 2012·Granted Mar 18, 2014·5 cites·20 claims
- 2081US2024274589A1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2180US10015888B2Interconnect joint protective layer apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 3, 2018·5 cites·20 claims
- 2279US12144065B2Warpage control in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2378US11874513B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 2477US11996400B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2577US8629053B2Plasma treatment for semiconductor devicesLU CHEN-FA·Filed 2010·Granted Jan 14, 2014·4 cites·17 claims
- 2674US9538582B2Warpage control in the packaging of integrated circuitsCHENG MING-DA·Filed 2012·Granted Jan 3, 2017·2 cites·20 claims
- 2773US11901258B2Iintegrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2873US2024332215A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2970US11342321B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 3070US10903090B2Method of singulate a package structure using a light transmitting film on a polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 26, 2021·1 cites·20 claims
- 3170US6692985B2Solar cell substrate with thin film polysiliconIND TECH RES INST·Filed 2002·Granted Feb 17, 2004·20 cites·16 claims
- 3269US9935044B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·1 cites·19 claims
- 3367US12261088B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·20 claims
- 3467US2025201640A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3565US12051655B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 3665US9281288B2System and method for fine pitch PoP structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·1 cites·20 claims
- 3764USD977582SToy carCHEN CHENG·Filed 2022·Granted Feb 7, 2023·2 cites·1 claims
- 3863US2025246587A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 3961US11158605B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 26, 2021·0 cites·20 claims
- 4061US2025372491A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4160US11850531B2Rollable toy carCHEN CHENG·Filed 2023·Granted Dec 26, 2023·0 cites·10 claims
- 4260US9355927B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·0 cites·20 claims
- 4360US2025246555A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 4458US9583464B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 4557US10534353B2System and method to reduce pre-back-grinding process defectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 14, 2020·0 cites·20 claims
- 4657US2024371711A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 4755US2024373752A1Semiconductor substrate and package structure including the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 4854US9418955B2Plasma treatment for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·0 cites·20 claims
- 4950US8571699B2System and method to reduce pre-back-grinding process defectsLU CHEN-FA·Filed 2010·Granted Oct 29, 2013·0 cites·20 claims
- 5050US6277667B1Method for fabricating solar cellsIND TECH RES INST·Filed 1999·Granted Aug 21, 2001·17 cites·34 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →