Inventor · disambiguated record
Ching-Fang Chen
Also filed as: CHEN CHING-FANG
30 granted patents·5 pending applications·44 citations·filing 2011–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21GLOBAL UNICHIP CORP5CHEN LUNG-SHAN3CHUANG YI-LIN2CHEN CHING-FANG1
Top patents by PatentIndex Score
35 records- 0196US10678973B2Machine-learning design enablement platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·13 cites·20 claims
- 0292US11646313B2Semiconductor and circuit structures, and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
- 0389US11017149B2Machine-learning design enablement platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 25, 2021·2 cites·20 claims
- 0487US11031923B1Interface device and interface method for 3D semiconductor deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0586US12253558B2Circuit test structure and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0686US2025087580A1Method of forming a semiconductor device with inter-layer vias and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0785US9679840B2Method for layout design and structure with inter-layer viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 13, 2017·5 cites·20 claims
- 0879US11002788B2Circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 0979US9817029B2Test probing structureWANG MILL-JER·Filed 2011·Granted Nov 14, 2017·4 cites·20 claims
- 1079US2025164548A1Method of using circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1176US10288676B2Circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·20 claims
- 1275US12272691B2Semiconductor and circuit structures, and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1375US12154851B2Method of forming a semiconductor device with inter-layer viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1475US11828790B2Circuit test structure and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 1571US8863062B2Methods and apparatus for floorplanning and routing co-designCHUANG YI-LIN·Filed 2012·Granted Oct 14, 2014·3 cites·20 claims
- 1671US8707238B2Method to determine optimal micro-bump-probe pad pairing for efficient PGD testing in interposer designsCHUANG YI-LIN·Filed 2012·Granted Apr 22, 2014·3 cites·19 claims
- 1770US11114376B2System for layout design of structure with inter layer viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 7, 2021·0 cites·20 claims
- 1870US9003338B2Common template for electronic articleTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 7, 2015·2 cites·20 claims
- 1969US11585831B2Test probing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 2063US9040986B2Three dimensional integrated circuit having a resistance measurement structure and method of useCHEN CHING-FANG·Filed 2012·Granted May 26, 2015·1 cites·20 claims
- 2162US8490518B2Oil filter replacement deviceCHEN LUNG-SHAN·Filed 2011·Granted Jul 23, 2013·3 cites·3 claims
- 2260US8984728B2Drawing deviceCHEN LUNG-SHAN·Filed 2012·Granted Mar 24, 2015·2 cites·10 claims
- 2359US10566278B2Method for layout design and structure with inter-layer viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·20 claims
- 2456US10782318B2Test probing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·0 cites·20 claims
- 2556US9689914B2Method of testing a three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 2654US2025068811A1Systems and Methods for Implementing Design of Semiconductor PackagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2753US11144485B1Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Oct 12, 2021·0 cites·26 claims
- 2852US11200364B2Method and associated system for circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 2951US11687472B2Interface for semiconductor device and interfacing method thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 27, 2023·0 cites·22 claims
- 3051US9613174B2Common template for electronic articleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 3150US11699683B2Semiconductor device in 3D stack with communication interface and managing method thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Jul 11, 2023·0 cites·16 claims
- 3249US11675731B2Data protection system and method thereof for 3D semiconductor deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 3343US9952279B2Apparatus for three dimensional integrated circuit testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Apr 24, 2018·0 cites·19 claims
- 3439US2012079919A1Oil filter canister adapterCHEN LUNG-SHAN·Filed 2011·Application pending·0 cites
- 3534US2018326617A1Diamond wire sawSTONE & RESOURCE IND R&D CENTER·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →