Inventor · disambiguated record
Chender Chen
Also filed as: CHEN CHENDER
9 granted patents·22 citations·filing 2008–2015
83Inventor score
Top patents by PatentIndex Score
9 records- 0189US8581374B1Placing heat sink into packaging by strip formation assemblyCHEN CHENDER·Filed 2011·Granted Nov 12, 2013·11 cites·19 claims
- 0272US9064784B1Ball grid array package with laser vias and methods for making the sameLIU CHENGLIN·Filed 2010·Granted Jun 23, 2015·4 cites·10 claims
- 0367US9202797B1Lead frame apparatus and method for improved wire bondingMARVELL INT LTD·Filed 2014·Granted Dec 1, 2015·2 cites·22 claims
- 0464US8741694B1Placing heat sink into packaging by strip formation assemblyMARVELL INT LTD·Filed 2013·Granted Jun 3, 2014·1 cites·18 claims
- 0563US8754513B1Lead frame apparatus and method for improved wire bondingCHEN CHENDER·Filed 2009·Granted Jun 17, 2014·3 cites·7 claims
- 0659US8415785B1Metal ring techniques and configurationsCHEN CHENDER·Filed 2011·Granted Apr 9, 2013·1 cites·20 claims
- 0750US8749045B1Metal ring techniques and configurationsMARVELL INT LTD·Filed 2013·Granted Jun 10, 2014·0 cites·20 claims
- 0847US8278563B1Via to plating busCHEN CHENDER·Filed 2008·Granted Oct 2, 2012·0 cites·22 claims
- 0945US9299589B1Ball grid array package with laser vias and methods for making the sameMARVELL INT LTD·Filed 2015·Granted Mar 29, 2016·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →