Inventor · disambiguated record
Chunfu Chen
Also filed as: CHEN CHUNFU
12 granted patents·11 pending applications·75 citations·filing 2002–2025
86Inventor score
Top patents by PatentIndex Score
23 records- 0185US10717907B2Photo-curable adhesive composition, preparation and use thereofHENKEL AG & CO KGAA·Filed 2017·Granted Jul 21, 2020·4 cites·16 claims
- 0283US6787606B1Electrochromic device with composition of epoxy resin, toughener and latent curativeHENKEL CORP·Filed 2002·Granted Sep 7, 2004·56 cites·14 claims
- 0371US7795744B2Cationically curable epoxy resin compositionHENKEL CORP·Filed 2004·Granted Sep 14, 2010·12 cites·11 claims
- 0468US2024101754A1Dual curing composition based on acrylate functional compoundsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0568US2024254276A1Two component (2k) composition based on epoxy (meth)acrylate resinHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0666US11873368B2Two component (2K) composition based on modified epoxy resinHENKEL AG & CO KGAA·Filed 2021·Granted Jan 16, 2024·0 cites·14 claims
- 0766US2023331902A1Two component (2k) epoxy formulationHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0865US2023332025A1Two-part epoxy-based structural adhesive compositionHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0964US12338342B2One component (1K) composition based on epoxy resinHENKEL AG & CO KGAA·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1064US2025188323A1Curable two-step and two-part acrylic structural adhesive compositionHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 1162US12497505B2One component (1K) composition based on modified epoxy resinHENKEL AG & CO KGAA·Filed 2022·Granted Dec 16, 2025·0 cites·16 claims
- 1261US11390742B2Epoxy based compositionHENKEL AG & CO KGAA·Filed 2020·Granted Jul 19, 2022·0 cites·14 claims
- 1361US2023108593A1One Component Liquid Resin CompositionHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1461US2022017743A1Photo-curable compositions for additive manufacturingHENKEL AG & CO KGAA·Filed 2021·Application pending·0 cites
- 1560US11866535B2Two-part epoxy based compositionHENKEL AG & CO KGAA·Filed 2021·Granted Jan 9, 2024·0 cites·11 claims
- 1660US8288451B2Photo-curable resin composition for ultraviolet light-LED irradiationCHEN CHUNFU·Filed 2011·Granted Oct 16, 2012·1 cites·4 claims
- 1755US7456230B2Cationically photocurable epoxy resin compositionsHENKEL CORP·Filed 2003·Granted Nov 25, 2008·2 cites·16 claims
- 1853US11566151B2Photo-curable liquid optically clear adhesive composition and the use thereofHENKEL AG & CO KGAA·Filed 2017·Granted Jan 31, 2023·0 cites·31 claims
- 1951US10100236B2Light curable resin compositionHENKEL AG & CO KGAA·Filed 2016·Granted Oct 16, 2018·0 cites·11 claims
- 2051US2025320329A1Dual curing composition based on methacrylate functional compoundsHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 2150US2025207003A1Two component composition based on a blend of epoxide compoundsHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 2241US2013165600A1One component epoxy resin compositionHENKEL CORP·Filed 2013·Application pending·0 cites
- 2326US2012018088A1Method for connecting electrodes and bonding composition used thereforCHEN CHUNFU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →