Inventor · disambiguated record
Chien-Han Chen
Also filed as: CHEN CHIEN-HAN
10 granted patents·13 pending applications·8 citations·filing 2012–2025
81Inventor score
Top patents by PatentIndex Score
23 records- 0188US10522468B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·5 cites·20 claims
- 0287US2025343149A1Interconnect structure with vias extending through multiple dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0385US11251127B2Interconnect structure with vias extending through multiple dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 15, 2022·3 cites·20 claims
- 0476US2025239487A1Semiconductor device with self-aligned viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0574US12444687B2Interconnect structure with vias extending through multiple dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0671US12293944B2Semiconductor device with self-aligned viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 0771US2024387254A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0870US12148657B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 0970US2024387227A1Semiconductor device, method and tool of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1070US2025254956A1Dual damascene structure in forming source/drain contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1168US2025122367A1Polymer composite, use thereof, low dielectric resin composition, prepreg, and metal foil laminated boardLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 1267US12310077B2Dual damascene structure in forming source/drain contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1365US2023331971A1Hydrocarbon resin polymer, preparation method thereof, and composition and substrate comprising the sameLCY CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1459US2022367226A1Semiconductor Device, Method and Tool of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 1557US11502001B2Semiconductor device with self-aligned viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·20 claims
- 1656US2025157927A1Low resistance signal transduction enabled by high efficiency copper feedthroughsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1754US2025101151A1Hydrocarbon resin polymer and manufacturing method thereof and substrate structureLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 1852US2025066582A1Resin composition and manufacturing method thereof and substrate structureLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 1951US2023377956A1Method of forming an interconect structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2049US11615983B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 2146US9348185B2Pixel structure and manufacturing method thereofCHEN CHIEN-HAN·Filed 2012·Granted May 24, 2016·0 cites·12 claims
- 2246US2022367253A1Interconnect structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2332US9684216B2Pixel structure and fabrication method thereofCHEN CHIEN-HAN·Filed 2012·Granted Jun 20, 2017·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Chien-Han Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →