Inventor · disambiguated record
Chien-Hua Chen
Also filed as: CHEN CHIEN-HUA
336 granted patents·84 pending applications·2,301 citations·filing 1993–2025
99Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO254CHEN CHIEN-HUA29ADVANCED SEMICONDUCTOR ENG26HEWLETT PACKARD DEVELOPMENT CO LP15HEWLETT PACKARD CO11
Top patents by PatentIndex Score
420 records- 0198US9944080B2Molded fluid flow structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Apr 17, 2018·13 cites·15 claims
- 0298US9844946B2Molded printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Dec 19, 2017·6 cites·20 claims
- 0398US9724920B2Molded die slivers with exposed front and back surfacesHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Aug 8, 2017·14 cites·14 claims
- 0498US9446590B2Diagonal openings in photodefinable glassCHEN CHIEN-HUA·Filed 2012·Granted Sep 20, 2016·53 cites·10 claims
- 0598US7576439B2Electrically connecting substrate with electrical deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Aug 18, 2009·109 cites·17 claims
- 0698US7262495B23D interconnect with protruding contactsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 28, 2007·395 cites·43 claims
- 0797US10304765B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 28, 2019·37 cites·20 claims
- 0897US9837352B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 5, 2017·41 cites·22 claims
- 0997US9446587B2Molded printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Sep 20, 2016·17 cites·20 claims
- 1097US7476608B2Electrically connecting substrate with electrical deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jan 13, 2009·105 cites·12 claims
- 1196US8766970B2Pixel circuit, display panel, and driving method thereofCHIEN CHIH-YUAN·Filed 2008·Granted Jul 1, 2014·144 cites·11 claims
- 1296US7828417B2Microfluidic device and a fluid ejection device incorporating the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Nov 9, 2010·22 cites·23 claims
- 1396US7619535B2Power monitoring apparatus of fanDELTA ELECTRONICS INC·Filed 2006·Granted Nov 17, 2009·40 cites·20 claims
- 1495US10605541B1Heat pipe—thermal storage medium based cool storage systemADVANCED COOLING TECH INC·Filed 2016·Granted Mar 31, 2020·13 cites·27 claims
- 1595US10232619B2Printhead with bond pad surrounded by damHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 19, 2019·5 cites·20 claims
- 1695US10226926B2Printbars and methods of forming printbarsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 12, 2019·4 cites·20 claims
- 1795US9997447B1Semiconductor devicesADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 12, 2018·14 cites·17 claims
- 1895US9731509B2Fluid structure with compression molded fluid channelHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Aug 15, 2017·10 cites·16 claims
- 1994US11046084B2Liquid level sensingHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jun 29, 2021·6 cites·20 claims
- 2094US8336981B2Determining a healthy fluid ejection nozzleCHEN CHIEN-HUA·Filed 2009·Granted Dec 25, 2012·24 cites·11 claims
- 2194US7991988B2Communication device and firmware update method thereofHON HAI PREC IND CO LTD·Filed 2008·Granted Aug 2, 2011·36 cites·20 claims
- 2294US7417307B2System and method for direct-bonding of substratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 26, 2008·36 cites·11 claims
- 2392US10207500B2Print head interposersHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Feb 19, 2019·3 cites·15 claims
- 2492US9919525B2Printed circuit board fluid ejection apparatusHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 20, 2018·2 cites·20 claims
- 2592US9895888B2Fluid flow structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Feb 20, 2018·5 cites·11 claims
- 2692US9751319B2Printing fluid cartridgeHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Sep 5, 2017·2 cites·19 claims
- 2792US7004034B2Pressure sensor and method of making the same having membranes forming a capacitorHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 28, 2006·40 cites·20 claims
- 2892US6534247B2Method of fabricating micromachined ink feed channels for an inkjet printheadHEWLETT PACKARD CO·Filed 2001·Granted Mar 18, 2003·38 cites·19 claims
- 2992US5417897AMethod for forming tapered inkjet nozzlesHEWLETT PACKARD CO·Filed 1994·Granted May 23, 1995·86 cites·11 claims
- 3091US11807523B2Three-dimensional features formed in molded panelHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Nov 7, 2023·1 cites·15 claims
- 3191US9770909B2Printhead dies molded with nozzle health sensorHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Sep 26, 2017·5 cites·20 claims
- 3291US8853819B2Semiconductor structure with passive element network and manufacturing method thereofCHEN CHIEN-HUA·Filed 2011·Granted Oct 7, 2014·16 cites·20 claims
- 3391US6273557B1Micromachined ink feed channels for an inkjet printheadHEWLETT PACKARD CO·Filed 1999·Granted Aug 14, 2001·64 cites·25 claims
- 3490US11020967B2PrintheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 1, 2021·2 cites·15 claims
- 3590US9919524B2Printhead with bond pad surrounded by damHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Mar 20, 2018·4 cites·19 claims
- 3689USD537795SQuad push button switchBOARD TECH ELECTRONIC CO LTD·Filed 2006·Granted Mar 6, 2007·35 cites·1 claims
- 3788US11577456B2Molded panelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Feb 14, 2023·2 cites·11 claims
- 3888US11292265B2Fluid circulation and ejectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 5, 2022·2 cites·11 claims
- 3988US11292257B2Molded die slivers with exposed front and back surfacesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Apr 5, 2022·1 cites·14 claims
- 4088US10495388B1Thermal energy storage system with tunable phase change compositionADVANCED COOLING TECH INC·Filed 2017·Granted Dec 3, 2019·4 cites·19 claims
- 4188US9539814B2Molded printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Jan 10, 2017·4 cites·14 claims
- 4287US7916108B2Liquid crystal display panel with color washout improvement and applications of sameAU OPTRONICS CORP·Filed 2008·Granted Mar 29, 2011·8 cites·25 claims
- 4387US7307773B2Micro-optoelectromechanical system packages for a light modulator and methods of making the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 11, 2007·10 cites·62 claims
- 4486US11666908B2Microfluidic packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jun 6, 2023·2 cites·20 claims
- 4586US11065883B2Cross-die recirculation channels and chamber recirculation channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jul 20, 2021·2 cites·20 claims
- 4686US7212699B2Fabricating a photonic dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted May 1, 2007·12 cites·24 claims
- 4786US6662663B2Pressure sensor with two membranes forming a capacitorHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 16, 2003·27 cites·4 claims
- 4885US11408684B1Loop heat pipe evaporatorADVANCED COOLING TECH INC·Filed 2018·Granted Aug 9, 2022·4 cites·27 claims
- 4985US11155086B2Fluidic ejection devices with enclosed cross-channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 26, 2021·2 cites·20 claims
- 5085US10576748B2Fluid reservoir with fluid property and level detectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 3, 2020·2 cites·13 claims
Showing the top 50 of 420 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →