Inventor · disambiguated record
Chun-Kai Chen
Also filed as: CHEN CHUN Y · CHEN CHUN-KAI
10 granted patents·10 pending applications·26 citations·filing 2004–2025
84Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15LANTO ELECTRONIC LTD2TAIWAN SEMICONDUCTOR MFG1UNIV NAT TAIWAN1WISTRON NEWEB CORP1
Top patents by PatentIndex Score
20 records- 0196US11715640B2Patterning material including silicon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·3 cites·20 claims
- 0296US9679804B1Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·19 cites·20 claims
- 0394US11842922B2Method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0481US12308283B2Method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 0581US12205824B2Patterning material including silicon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0680US2025266292A1Method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0780US2025336675A1Metal hard masks for reducing line bendingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0877US11049763B2Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·1 cites·20 claims
- 0977US2025336725A1Transistor contacts and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1075US2025079172A1Metal hard masks for reducing line bendingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1172US10867794B2Patterning method for semiconductor devices and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 1272US2025167000A1Patterning material including silicon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1366US12183577B2Metal hard masks for reducing line bendingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·19 claims
- 1464US2025167626A1Damper gel tank and voice coil motorLANTO ELECTRONIC LTD·Filed 2024·Application pending·0 cites
- 1559US2024305162A1Damper device and electronic apparatusLANTO ELECTRONIC LTD·Filed 2023·Application pending·0 cites
- 1657US10510585B2Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
- 1756US12227619B2Polyimide based copolymer and electronic component and field effect transistor comprising the sameUNIV NAT TAIWAN·Filed 2021·Granted Feb 18, 2025·0 cites·4 claims
- 1854US2025062532A1Antenna structure and heat dissipation deviceWISTRON NEWEB CORP·Filed 2024·Application pending·0 cites
- 1948US2022102200A1Patterning material including carbon-containing layer and method for semiconductor device fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2036US2005262053A1System and method for storing and accessing information via smart knowledge agentsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →