Inventor · disambiguated record
Chih-Hua Chen
Also filed as: CHEN CHIH-HUA
125 granted patents·12 pending applications·1,227 citations·filing 2007–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD79TAIWAN SEMICONDUCTOR MFG21CHEN CHIH-HUA17HON HAI PREC IND CO LTD6CHANGHUA CHRISTIAN MEDICAL FOUND CHANGHUA CHRISTIAN HOSPITAL2
Top patents by PatentIndex Score
137 records- 0199US9881850B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·56 cites·20 claims
- 0299US7564115B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 21, 2009·155 cites·15 claims
- 0398US9343442B2Passive devices in package-on-package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 17, 2016·56 cites·20 claims
- 0498US9258922B2PoP structures including through-assembly via modulesCHEN CHIH-HUA·Filed 2012·Granted Feb 9, 2016·54 cites·18 claims
- 0598US8975726B2POP structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 10, 2015·140 cites·17 claims
- 0698US7973413B2Through-substrate via for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 5, 2011·132 cites·15 claims
- 0797US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0897US9691708B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·26 cites·20 claims
- 0997US8922005B2Methods and apparatus for package on package devices with reversed stud bump through via interconnectionsHU YEN-CHANG·Filed 2012·Granted Dec 30, 2014·62 cites·18 claims
- 1097US8476769B2Through-silicon vias and methods for forming the sameCHEN CHIH-HUA·Filed 2007·Granted Jul 2, 2013·67 cites·27 claims
- 1197US7969013B2Through silicon via with dummy structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jun 28, 2011·32 cites·10 claims
- 1297US7816227B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 19, 2010·45 cites·20 claims
- 1396US11749640B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 1496US10510713B1Semicondcutor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·12 cites·20 claims
- 1596US8928114B2Through-assembly via modules and methods for forming the sameCHEN CHIH-HUA·Filed 2012·Granted Jan 6, 2015·26 cites·20 claims
- 1695US9589941B1Multi-chip package system and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·10 cites·20 claims
- 1795US9490167B2Pop structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·12 cites·20 claims
- 1895US9224688B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·17 cites·20 claims
- 1994US11747899B2Gaze-based window adjustmentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Sep 5, 2023·7 cites·19 claims
- 2094US10074615B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·10 cites·20 claims
- 2194US9881885B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·11 cites·19 claims
- 2294US8889484B2Apparatus and method for a component packageTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·16 cites·20 claims
- 2394US8049327B2Through-silicon via with scalloped sidewallsTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 1, 2011·30 cites·20 claims
- 2493US11685055B2Robot gripper for moving wafer carriers and packing materials and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·6 cites·20 claims
- 2593US10707094B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 7, 2020·6 cites·20 claims
- 2693US10276402B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·8 cites·19 claims
- 2793US9478474B2Methods and apparatus for forming package-on-packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 25, 2016·18 cites·20 claims
- 2893US7514797B2Multi-die wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 7, 2009·22 cites·19 claims
- 2992US11205636B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·20 claims
- 3092US10629580B2Packaging mechanisms for dies with different sizes of connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·4 cites·20 claims
- 3191US12017342B2Robot gripper for moving wafer carriers and packing materials and method of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·2 cites·20 claims
- 3291US8315054B2Rack server centerCHEN CHIH-HUA·Filed 2011·Granted Nov 20, 2012·11 cites·7 claims
- 3390US12068212B2Package structure with through via extending through redistribution layer and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 3490US10510631B2Fan out package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 3590US10510644B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 3690US10361181B2Packaging mechanisms for dies with different sizes of connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·4 cites·20 claims
- 3790US10268868B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·4 cites·20 claims
- 3890US10157829B2Method for forming a passive device on a package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·4 cites·20 claims
- 3989US9875388B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 23, 2018·4 cites·20 claims
- 4089US8598715B2Bump-on-trace structures in packagingCHEN CHIH-HUA·Filed 2011·Granted Dec 3, 2013·10 cites·20 claims
- 4188US8624376B1Package-on-package structure without through assembly viasTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 7, 2014·7 cites·20 claims
- 4288US2024386744A1Fingerprint Sensor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4387US11488878B2Packaging mechanisms for dies with different sizes of connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·1 cites·20 claims
- 4487US9904776B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 27, 2018·3 cites·20 claims
- 4587US8193639B2Dummy metal design for packaging structuresLIU TZUAN-HORNG·Filed 2010·Granted Jun 5, 2012·8 cites·20 claims
- 4687US2024387498A1Manufacturing method of semiconductor package with thermal relaxation blockTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4786US12431446B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 4886US10762319B2Fingerprint sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·3 cites·20 claims
- 4986US10672729B2Package structure and method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 2, 2020·3 cites·20 claims
- 5085US10878073B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·1 cites·20 claims
Showing the top 50 of 137 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chih-Hua Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →