Inventor · disambiguated record
Chieh-En Chen
Also filed as: CHEN CHIEH-EN
0 granted patents·13 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
13 records- 0174US2025338662A1Two layer pixel structure for high resolution with high dynamic rangeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0272US2025336773A1Through substrate via landing on front end of line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0371US2025116708A1Battery control parameter estimation system and battery control parameter estimation methodRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0469US2025275282A1Two layer pixel structure for high resolution with high dynamic rangeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0564US2024379500A1Through substrate via landing on front end of line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0661US2025116713A1Method of estimating state of charge of battery and system thereofRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0761US2025116719A1Method and System of Determining Reference Internal Impedance of BatteryRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0858US2025294905A1Image sensors and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0955US2025063834A1Full backside deep trench isolation structure for a semiconductor pixel sensor arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1054US2025015124A1Metal-insulator-metal capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1153US2025014987A1Integrated chip including through-substrate via (tsv) and landing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1251US2024021636A1Optical structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1349US2025029894A1Dual via structure for through-chip connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →