Inventor · disambiguated record
Chi-Yuan Chen
Also filed as: CHEN CHI-YUAN
40 granted patents·21 pending applications·183 citations·filing 2001–2025
97Inventor score
Files withMEDIATEK INC15TAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG8CHEN CHI-YUAN7SYNAGE TECHNOLOGY CORP3
Top patents by PatentIndex Score
61 records- 0197US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0295US8889497B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·22 cites·20 claims
- 0391US12394094B1Extrinsic calibration parameter generating device, method, and non-transitory computer readable storage medium thereofHTC CORP·Filed 2024·Granted Aug 19, 2025·1 cites·20 claims
- 0490US9287170B2Contact structure and formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·8 cites·20 claims
- 0589US10157995B2Integrating junction formation of transistors with contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 18, 2018·9 cites·20 claims
- 0689US8720014B2Trigger gripCHEN CHI-YUAN·Filed 2011·Granted May 13, 2014·15 cites·13 claims
- 0787US9048087B2Methods for wet clean of oxide layers over epitaxial layersTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·8 cites·20 claims
- 0886US8720013B2Trigger gripCHEN CHI-YUAN·Filed 2011·Granted May 13, 2014·9 cites·4 claims
- 0985US10549017B2Suction discSUNEETEK XIAMEN MEDICAL EQUIPMENT CO LTD·Filed 2017·Granted Feb 4, 2020·21 cites·8 claims
- 1084US10756040B2Semiconductor package with rigid under bump metallurgy (UBM) stackMEDIATEK INC·Filed 2018·Granted Aug 25, 2020·4 cites·19 claims
- 1183US9245797B2Opening fill process and structure formed therebyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·4 cites·19 claims
- 1282US8927418B1Systems and methods for reducing contact resistivity of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 6, 2015·5 cites·20 claims
- 1381US9978583B2Opening fill process and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 22, 2018·2 cites·20 claims
- 1480US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 1579US8399246B2Baculovirus expression vector and method therewith for generating immunogenicity in a hostHU YU-CHEN·Filed 2009·Granted Mar 19, 2013·3 cites·6 claims
- 1677US2025343047A1Fin field-effect transistor device and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1776US9624576B2Systems and methods for gap filling improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 18, 2017·3 cites·19 claims
- 1876US6668293B2Auto-registration of scannerNETIMAGE CORP·Filed 2001·Granted Dec 23, 2003·30 cites·15 claims
- 1975US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 2073US11705413B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 2173US2024429113A1Lidded semiconductor packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2270US9627313B2Opening fill process and structure formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·1 cites·20 claims
- 2370US8552180B2Method for separating amide from amino acid ionic liquidHSIEH CHENG-FA·Filed 2009·Granted Oct 8, 2013·2 cites·18 claims
- 2470US2024363353A1Fin field-effect transistor device and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2569US9153657B2Semiconductor devices comprising a finTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 6, 2015·2 cites·20 claims
- 2667US12080614B2Lidded semiconductor packageMEDIATEK INC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 2767US11444028B2Contact structure and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 2861US12388194B2Antenna-in-module package-on-package with air trenchesMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·14 claims
- 2960US2025233040A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3059US11471585B2Negative pressure wound therapy device, system and methodXIAMEN SUNEETEK MEDICAL EQUIPMENT CO LTD·Filed 2018·Granted Oct 18, 2022·1 cites·9 claims
- 3159US10510664B2Contact structure and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
- 3259US2025009763A1Methods for extending lifespan and/or delaying agingUNIV CHANG GUNG·Filed 2023·Application pending·0 cites
- 3357US9735107B2Contact structure and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 15, 2017·0 cites·20 claims
- 3457US2025174533A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3557US2024243046A1Flip chip ball grid array packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3656US2025040213A1Semiconductor devices and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3755US2024321674A1Semiconductor deviceMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3855US2024145350A1Semiconductor device and manufacturing method thereofMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3954USD1039356SHandle of a cutting toolALLPROFESSIONAL MFG CO LTD·Filed 2023·Granted Aug 20, 2024·1 cites·1 claims
- 4054US10283359B2Systems and methods for gap filling improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·20 claims
- 4154US2025372547A1Semiconductor structureMEDIATEK INC·Filed 2025·Application pending·0 cites
- 4249USD645888STrigger gripCHEN CHI-YUAN·Filed 2011·Granted Sep 27, 2011·9 cites·1 claims
- 4348US9856480B2Dnazyme for silencing the expression of EGFRDCB-USA LLC·Filed 2014·Granted Jan 2, 2018·0 cites·24 claims
- 4447US8367865B2Method and catalyst composition for preparing amideCHINA PETRICHEMICAL DEV CORP·Filed 2009·Granted Feb 5, 2013·0 cites·9 claims
- 4547US7042658B2Lens forchromatic aberration compensationSYNAGE TECHNOLOGY CORP·Filed 2004·Granted May 9, 2006·5 cites·17 claims
- 4646US2009188560A1Concentrating photovoltaic apparatusLEE SEN-TIEN·Filed 2008·Application pending·0 cites
- 4745US8853083B2Chemical mechanical polish in the growth of semiconductor regionsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·0 cites·20 claims
- 4845US2021217707A1Semiconductor package having re-distribution layer structure on substrate componentMEDIATEK INC·Filed 2020·Application pending·0 cites
- 4944US9508716B2Methods of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·0 cites·20 claims
- 5044US9064959B2Method and apparatus for forming a CMOS deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →