Inventor · disambiguated record
Chien-Ying Chen
Also filed as: CHEN CHIEN Y · CHEN CHIEN-YING
31 granted patents·21 pending applications·65 citations·filing 2005–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38ASUSTEK COMP INC7TECO IMAGE SYS CO LTD5AU OPTRONICS CORP1CHEN CHIEN-YING1
Top patents by PatentIndex Score
52 records- 0198US11803682B2Semiconductor device including standard cell having split portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 31, 2023·5 cites·20 claims
- 0296US11574865B2Method of forming semiconductor device including deep viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·2 cites·20 claims
- 0393US10741540B2Integrated circuit layout method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·5 cites·20 claims
- 0488US11501051B2Memory device, integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 0588US10396063B2Circuit with combined cells and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 27, 2019·7 cites·8 claims
- 0687US9731493B2Printing platform supporting module and three-dimensional printer using sameTECO IMAGE SYS CO LTD·Filed 2015·Granted Aug 15, 2017·3 cites·17 claims
- 0787US2025365945A1Backside metal rom device, layout, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0887US2025359041A1Rom device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0985US12211791B2Semiconductor device including deep viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1084US12243867B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1184US11127673B2Semiconductor device including deep vias, and method of generating layout diagram for sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 1284US8188703B2Energy harvesting systemCHEN CHIEN-YING·Filed 2010·Granted May 29, 2012·14 cites·18 claims
- 1384US2025291993A1Memory device, computer-readable recording medium and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1483US11342341B2Integrated circuit layout, method, structure, and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·1 cites·20 claims
- 1582US12430487B2Semiconductor device including standard cell having split portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 1682US12300603B2Modified fuse structure and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1782US2024311544A1Semiconductor device including standard cell having split portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1881US11854966B2Method of forming semiconductor device including deep viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 26, 2023·0 cites·20 claims
- 1981US2025344380A1Memory devices with partially misaligned gap locations and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2081US2025228011A1Integrated circuit layout method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2180US8031465B2Electronic apparatusASUSTEK COMP INC·Filed 2009·Granted Oct 4, 2011·9 cites·7 claims
- 2279US12080641B2Electrical fuse bit cell in integrated circuit having backside conducting linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 2379US2025203859A1Rom device, layout, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2479US2024363530A1Electrical fuse bit cell in integrated circuit having backside conducting linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2579US2025266347A1Modified fuse structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2679US2025203856A1Backside metal rom device, layout, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2779US2025174552A1Semiconductor device including deep vias and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2878US12089402B2Integrated circuit layout and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 2978US11776949B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 3077US12361192B2Memory device, integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 3177US12039245B2Semiconductor device including standard cell having split portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 3274US11696437B2Integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 3374US10065372B2Steel wire transmission system for three-dimensional printer and adjusting mechanism thereofTECO IMAGE SYS CO LTD·Filed 2015·Granted Sep 4, 2018·2 cites·6 claims
- 3474US7433189B2Electronic device and heat dissipation module thereofASUSTEK COMP INC·Filed 2007·Granted Oct 7, 2008·6 cites·18 claims
- 3573US11355488B2Integrated circuit layout method, device, and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 3671US2024098988A1Integrated circuit with back-side metal line, method of fabricating the same, and layout methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3770US11854968B2Modified fuse structure and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3870US11837539B2Electrical fuse bit cell in integrated circuit having backside conducting linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 3967US11856760B2Bit cell with back-side metal line device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4065US2024373625A1Memory devices with partially misaligned gap locations and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4163US2025267833A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4262US2022238540A1Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4360US2025266321A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4456US12487645B2Fixing assembly and electronic deviceASUSTEK COMP INC·Filed 2024·Granted Dec 2, 2025·0 cites·9 claims
- 4555US7645144B2Interface card and butterfly interface transfer structureASUSTEK COMP INC·Filed 2009·Granted Jan 12, 2010·7 cites·17 claims
- 4653US11549796B2Thickness measuring deviceTECO IMAGE SYS CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·13 claims
- 4744US10406642B2Dual drive pressing apparatus for plural pressing headsTECO IMAGE SYS CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·13 claims
- 4843US2006044750A1Electronic device and fixing structure thereofASUSTEK COMP INC·Filed 2005·Application pending·0 cites
- 4943US2013128464A1Riser cardASUSTEK COMP INC·Filed 2012·Application pending·0 cites
- 5042US2006056147A1Electronic apparatus and latch structure thereofASUSTEK COMP INC·Filed 2005·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →