Inventor · disambiguated record
Chun-Cho Chen
Also filed as: CHEN CHUN-CHO
8 granted patents·3 pending applications·410 citations·filing 1996–2003
90Inventor score
Files withWINBOND ELECTRONICS CORP5HOLTEK MICROELECTRONICS INC1TAIWAN SEMICONDUCTOR MFG1UTEK SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
11 records- 0191US5770507AMethod for forming a gate-side air-gap structure in a salicide processWINBOND ELECTRONICS CORP·Filed 1997·Granted Jun 23, 1998·128 cites·9 claims
- 0288US6300223B1Method of forming die seal structures having substrate trenchesWINBOND ELECTRONICS CORP·Filed 1997·Granted Oct 9, 2001·107 cites·19 claims
- 0384US5877074AMethod for improving the electrical property of gate in polycide structureHOLTEK MICROELECTRONICS INC·Filed 1997·Granted Mar 2, 1999·61 cites·7 claims
- 0480US5891808AMethod for fabricating a die sealWINBOND ELECTRONICS CORP·Filed 1997·Granted Apr 6, 1999·67 cites·10 claims
- 0558US5953633AMethod for manufacturing self-aligned titanium salicide using two two-step rapid thermal annealing stepsUTEK SEMICONDUCTOR CORP·Filed 1997·Granted Sep 14, 1999·25 cites·6 claims
- 0643US7386539B2System, method, and user interface providing customized document portfolio managementTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 10, 2008·9 cites·29 claims
- 0739US5908314ATwo-step metal salicide semiconductor processWINBOND ELECTRONICS CORP·Filed 1997·Granted Jun 1, 1999·6 cites·15 claims
- 0834US5817438AMasking technology for etching contactsWINBOND ELECTRONICS CORP·Filed 1996·Granted Oct 6, 1998·7 cites·10 claims
- 0933US2004107214A1Customized document portfolio system integrating IP libraries and technology documentsFiled 2003·Application pending·0 cites
- 1032US2004107197A1System, method and user interface allowing customized portfolio managementFiled 2002·Application pending·0 cites
- 1131US2004117374A1Customized design portfolio integrating IP libraries and technology documentsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →