Inventor · disambiguated record
Chien-Fan Chen
Also filed as: CHEN CHIEN-FAN
29 granted patents·9 pending applications·91 citations·filing 2005–2025
94Inventor score
Top patents by PatentIndex Score
38 records- 0195US7476564B2Flip-chip packaging process using copper pillar as bump structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jan 13, 2009·51 cites·5 claims
- 0289US8552553B2Semiconductor deviceLO JIAN-WEN·Filed 2010·Granted Oct 8, 2013·16 cites·20 claims
- 0386US12267961B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0486US11335646B2Substrate structure including embedded semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 17, 2022·2 cites·21 claims
- 0586US8334594B2Chip having a metal pillar structureLO JIAN-WEN·Filed 2010·Granted Dec 18, 2012·12 cites·20 claims
- 0683US2025227849A1Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0781US11882660B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jan 23, 2024·0 cites·20 claims
- 0878US9768139B2Semiconductor device and semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 19, 2017·3 cites·21 claims
- 0977US9508671B2Semiconductor device and semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Nov 29, 2016·3 cites·19 claims
- 1075US2025132455A1Methods and apparatus for removing gas during thermal runaway in energy storage systemsENPHASE ENERGY INC·Filed 2024·Application pending·0 cites
- 1174US11553596B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 10, 2023·0 cites·17 claims
- 1274US11139179B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·2 cites·21 claims
- 1372US11032911B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 8, 2021·0 cites·19 claims
- 1472US2025055102A1Smart packaging and inventory control for batteries configured for use with energy management systemsENPHASE ENERGY INC·Filed 2024·Application pending·0 cites
- 1571US12469795B2Substrate structure including embedded semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Nov 11, 2025·0 cites·8 claims
- 1670US11228071B2Battery cell for electric vehicle battery packSF MOTORS INC·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 1769US10424769B1Integrated battery cell moduleSF MOTORS INC·Filed 2018·Granted Sep 24, 2019·0 cites·19 claims
- 1868US10622604B2Integrated battery modules in electric vehiclesSF MOTORS INC·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 1967US10734620B2Battery cell for electric vehicle battery packSF MOTORS INC·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 2066US2021143467A1System and method for a stable high temperature secondary batteryCUBERG INC·Filed 2020·Application pending·0 cites
- 2161US10757813B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 25, 2020·0 cites·26 claims
- 2259US2018248221A1System and method for a stable high temperature secondary batteryCUBERG INC·Filed 2018·Application pending·0 cites
- 2358US10930901B2Electric vehicle battery cell having a patterned surfaceSF MOTORS INC·Filed 2018·Granted Feb 23, 2021·0 cites·20 claims
- 2456US10756396B2Battery cells for battery packs in electric vehiclesSF MOTORS INC·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
- 2553US11923285B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Mar 5, 2024·0 cites·10 claims
- 2653US10950551B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 2753US10573864B2Battery cells for battery packs in electric vehiclesSF MOTORS INC·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
- 2853US7670512B2Second order nonlinear optical polyimides having benzobisthiazole-based pendant groups, and preparation of the sameUNIV NAT SUN YAT SEN·Filed 2006·Granted Mar 2, 2010·0 cites·33 claims
- 2952US10651439B2Integrated battery cell modules with plug-in battery cells for electric vehiclesSF MOTORS INC·Filed 2018·Granted May 12, 2020·0 cites·19 claims
- 3049US11296030B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·0 cites·18 claims
- 3148US11587881B2Substrate structure including embedded semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·18 claims
- 3246US2019296388A1Battery cell for electric vehicle battery packSF MOTORS INC·Filed 2018·Application pending·0 cites
- 3345US11277917B2Embedded component package structure, embedded type panel substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·10 claims
- 3445US2008261390A1Method for forming bumps on under bump metallurgyADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 3542US7671141B2Second order nonlinear optical polyimides having benzobisthiazole-based pendant groups, and preparation of the sameUNIV NAT SUN YAT SEN·Filed 2006·Granted Mar 2, 2010·2 cites·23 claims
- 3641US2019296273A1Battery cell for electric vehicle battery packSF MOTORS INC·Filed 2018·Application pending·0 cites
- 3741US2019296283A1Integrated battery cell modules with plug-in battery cells for electric vehiclesSF MOTORS INC·Filed 2018·Application pending·0 cites
- 3839US9741675B2Bump structures, semiconductor device and semiconductor device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Aug 22, 2017·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →