Inventor · disambiguated record
Chih-Lin Chen
Also filed as: CHEN CHIH · CHEN CHIH-LIN
12 granted patents·5 pending applications·25 citations·filing 2008–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11KUNG CHE-MIN2CHEN CHIH1GREAT COMPUTER CORP1MACRONIX INT CO LTD1
Top patents by PatentIndex Score
17 records- 0195US11658157B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0293US10535635B2Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·6 cites·20 claims
- 0391US10763164B2Package structure with inductor and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 1, 2020·7 cites·20 claims
- 0488US11043473B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·3 cites·20 claims
- 0582US12062641B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 0678US2025315069A1Semiconductor devices including voltage monitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0772US8983402B2Transceiver with wake up detectionUNIV NAT SUN YAT SEN·Filed 2013·Granted Mar 17, 2015·5 cites·12 claims
- 0869US12411508B2Semiconductor devices including voltage monitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 0968US11562926B2Package structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 1067US11075136B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 1161US7923770B2Memory device and method of fabricating the sameMACRONIX INT CO LTD·Filed 2008·Granted Apr 12, 2011·2 cites·13 claims
- 1260US10559517B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 1356US10163751B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·15 claims
- 1449US2013009143A1Photo sensor and method of fabricating the sameCHEN CHIH·Filed 2011·Application pending·0 cites
- 1542US2018161929A1Box-type laser processing machine capable of vacuum dedustingGREAT COMPUTER CORP·Filed 2016·Application pending·0 cites
- 1634US2013319975A1Laser processing machine with air curtain structureKUNG CHE-MIN·Filed 2012·Application pending·0 cites
- 1734US2013334180A1Automatic compound feeding and recalling laser processing equipmentKUNG CHE-MIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →