Inventor · disambiguated record
Chia-Pin Chen
Also filed as: CHEN CHIA P · CHEN CHIA-PIN
15 granted patents·11 pending applications·155 citations·filing 2003–2025
92Inventor score
Top patents by PatentIndex Score
26 records- 0194US7356888B2Multi-functional retaining strapCHAO KUO-CHIH·Filed 2005·Granted Apr 15, 2008·49 cites·3 claims
- 0288US9450671B2Transmitting and receiving apparatus and method for light communication, and the light communication system thereofIND TECH RES INST·Filed 2012·Granted Sep 20, 2016·10 cites·10 claims
- 0387US8942571B2Apparatus and method for data embedding in light communication and the light communication system and method thereofIND TECH RES INST·Filed 2012·Granted Jan 27, 2015·10 cites·42 claims
- 0487US7562933B1Bicycle seat and associated clampCHAO KUO CHIH·Filed 2006·Granted Jul 21, 2009·18 cites·8 claims
- 0577US7533480B2Bicycle shoe sole having coupling memberCHAO KUO CHIH·Filed 2005·Granted May 19, 2009·21 cites·3 claims
- 0675US11011444B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·1 cites·17 claims
- 0772US2025183104A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0871USD591066SBicycle seat padCHAO KUO-CHIH·Filed 2006·Granted Apr 28, 2009·19 cites·1 claims
- 0970US2024355763A1Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1068US7343702B2Bicycle shoe having protective deviceCHAO KUO CHIH·Filed 2005·Granted Mar 18, 2008·10 cites·6 claims
- 1164US12027469B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 2, 2024·0 cites·10 claims
- 1264US2021272866A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 1362US12010197B2System, method and computer-readable medium for data accessing17LIVE JAPAN INC·Filed 2023·Granted Jun 11, 2024·0 cites·8 claims
- 1459US2024275868A1System, method and computer-readable medium for data accessing17LIVE JAPAN INC·Filed 2024·Application pending·0 cites
- 1559US2025075918A1Recessed induction cooker with heat insulation protection pad structure and temperature detection deviceCHEN CHIA PIN·Filed 2023·Application pending·0 cites
- 1657US2006261019A1Bottle carrier device for cyclesCHAO KUO C·Filed 2005·Application pending·0 cites
- 1756USD523651SSaddle for bicycle or cycling exercisersCHAO KUO CHIH·Filed 2005·Granted Jun 27, 2006·11 cites·1 claims
- 1851US12183593B2Manufacturing method for manufacturing a package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 31, 2024·0 cites·12 claims
- 1950US7119300B2Method and apparatus of asynchronous electric discharge machine for wire cutIND TECH RES INST·Filed 2003·Granted Oct 10, 2006·4 cites·15 claims
- 2048US11798859B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 24, 2023·0 cites·15 claims
- 2147US2009223320A1Handlebar gripCHEN CHIA-PIN·Filed 2009·Application pending·0 cites
- 2244US2008079235A1Tubular cushioning device for bicycleCHAO KUO CHIH·Filed 2007·Application pending·0 cites
- 2341US2013003797A1Universal modem system and the manufacturing method thereofIND TECH RES INST·Filed 2012·Application pending·0 cites
- 2438US2007137430A1Pedal structure without front clamping membersCHAO KUO-CHIH·Filed 2005·Application pending·0 cites
- 2535US2006236810A1Bicycle pedal attaching deviceCHAO KUO C·Filed 2005·Application pending·0 cites
- 2633USD524070SProtective covering for saddle of bicycleCHAO KUO CHIH·Filed 2005·Granted Jul 4, 2006·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →