Inventor · disambiguated record
Chun-Hon Chen
Also filed as: CHEN CHUN-HON
16 granted patents·1 pending application·820 citations·filing 1996–2005
95Inventor score
Top patents by PatentIndex Score
17 records- 0197US6329234B1Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flowTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Dec 11, 2001·212 cites·34 claims
- 0295US5880040AGate dielectric based on oxynitride grown in N2 O and annealed in NOMACRONIX INT CO LTD·Filed 1996·Granted Mar 9, 1999·285 cites·26 claims
- 0392US6472721B2Dual damascene interconnect structures that include radio frequency capacitors and inductorsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 29, 2002·60 cites·13 claims
- 0487US7122878B2Method to fabricate high reliable metal capacitor within copper back-end processTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Oct 17, 2006·12 cites·14 claims
- 0580US6583491B1Microelectronic fabrication having microelectronic capacitor structure fabricated thereinTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 24, 2003·28 cites·5 claims
- 0679US6949781B2Metal-over-metal devices and the method for manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 27, 2005·26 cites·19 claims
- 0779US6916722B2Method to fabricate high reliable metal capacitor within copper back-end processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 12, 2005·22 cites·33 claims
- 0879US6734079B2Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated thereinTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 11, 2004·27 cites·20 claims
- 0978US7317221B2High density MIM capacitor structure and fabrication processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 8, 2008·29 cites·19 claims
- 1075US7050290B2Integrated capacitorTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 23, 2006·21 cites·21 claims
- 1172US7294544B1Method of making a metal-insulator-metal capacitor in the CMOS processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 13, 2007·44 cites·42 claims
- 1271US6881996B2Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 19, 2005·15 cites·8 claims
- 1365US6812088B1Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 2, 2004·11 cites·19 claims
- 1463US7035083B2Interdigitated capacitor and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 25, 2006·10 cites·16 claims
- 1562US6667217B1Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 23, 2003·12 cites·9 claims
- 1639US6051475AMethod for manufacturing a silicide to silicide capacitorTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 18, 2000·6 cites·20 claims
- 1738US2005082592A1Compact capacitor structure having high unit capacitanceTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →