Inventor · disambiguated record
Chuan-An Cheng
Also filed as: CHENG CHUAN-AN
3 granted patents·5 pending applications·8 citations·filing 2020–2025
59Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0196US11164848B2Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·6 cites·20 claims
- 0283US2025343201A1Multi-level stacking of wafers and chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0381US12125820B2Through-dielectric vias for direct connection and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·1 cites·20 claims
- 0481US11721663B2Multi-level stacking of wafers and chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·20 claims
- 0577US2024379614A1Multi-level stacking of wafers and chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0674US2025336856A1Packages with reduced bond wave propagation and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0771US2025323188A1Packages with reduced bond wave propagation and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0871US2023352439A1Multi-Level Stacking of Wafers and ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →