Inventor · disambiguated record
Chih-Min Cheng
Also filed as: CHENG CHIH-MIN · CHENG CHIH-MIN (STONE)
13 granted patents·15 pending applications·146 citations·filing 2001–2025
91Inventor score
Files withNAT STARCH CHEM INVEST11HENKEL AG & CO KGAA7Henkel IP & Holding GmbH3CHENG CHIH-MIN2HENKEL CORP1
Top patents by PatentIndex Score
28 records- 0192US8847184B2Composite film for board level EMI shieldingHENKEL CORP·Filed 2013·Granted Sep 30, 2014·10 cites·15 claims
- 0289US7326369B2Low stress conductive adhesiveNAT STARCH CHEM INVEST·Filed 2005·Granted Feb 5, 2008·11 cites·10 claims
- 0388US6344157B1Conductive and resistive materials with electrical stability for use in electronics devicesNAT STARCH CHEM INVEST·Filed 2001·Granted Feb 5, 2002·52 cites·20 claims
- 0486US9574118B2Adhesive compositionsHenkel US IP LLC·Filed 2014·Granted Feb 21, 2017·4 cites·16 claims
- 0585US9657203B2Adhesive compositionsHenkel IP & Holding GmbH·Filed 2015·Granted May 23, 2017·2 cites·24 claims
- 0675US6874573B2Thermal interface materialNAT STARCH CHEM INVEST·Filed 2003·Granted Apr 5, 2005·23 cites·11 claims
- 0773US12202918B2Photocurable (meth)acrylate compositionsHENKEL AG & CO KGAA·Filed 2022·Granted Jan 21, 2025·0 cites·24 claims
- 0871US2025154293A1Photocurable (meth)acrylate compositionsHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 0969US7456748B2RFID antenna with pre-applied adhesivesNAT STARCH CHEM INVEST·Filed 2005·Granted Nov 25, 2008·9 cites·9 claims
- 1066US12291646B2Photocurable (meth)acrylate compositionsHENKEL AG & CO KGAA·Filed 2022·Granted May 6, 2025·0 cites·26 claims
- 1165US6776226B1Electronic device containing thermal interface materialNAT STARCH CHEM INVEST·Filed 2003·Granted Aug 17, 2004·13 cites·16 claims
- 1263US2024254374A1Curable Compositions for Composite and Tool ReleaseHenkel IP & Holding GmbH·Filed 2022·Application pending·0 cites
- 1362US12043731B2Use of polyvinylacetate polymers or copolymers to increase the viscosity of the isocyanate component of a two-component curable polymeric systemHENKEL AG & CO KGAA·Filed 2021·Granted Jul 23, 2024·0 cites·13 claims
- 1462US2023265315A1Two-part, silane modified polymer/free radically curable adhesive systemsHenkel AG & Holding GmbH·Filed 2023·Application pending·0 cites
- 1560US2022315818A1Fold Protection for Spiral Filtration Modules Utilizing UV Cured Polyurethane and Method of Providing SameHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1659US6583201B2Conductive materials with electrical stability for use in electronics devicesNAT STARCH CHEM INVEST·Filed 2001·Granted Jun 24, 2003·15 cites·24 claims
- 1757US2024209247A1Green alternative polyurethane adhesiveHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1856US2023081461A1Photocurable color changing compositions and method of forming features on a membrane surface using the sameHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1953US7108806B2Conductive materials with electrical stability and good impact resistance for use in electronics devicesNAT STARCH CHEM INVEST·Filed 2003·Granted Sep 19, 2006·7 cites·14 claims
- 2049US2021197126A1Hydrogenated natural oils to thicken the polyol component of a two-component polyurethane adhesive for bonding membranesHenkel IP & Holding GmbH·Filed 2021·Application pending·0 cites
- 2147US2008292801A1Corrosion-Preventive Adhesive CompositionsNAT STARCH CHEM INVEST·Filed 2007·Application pending·0 cites
- 2247US2008054227A1Compositions for use in electronics devicesNAT STARCH CHEM INVEST·Filed 2007·Application pending·0 cites
- 2347US2007179232A1Thermal Interface MaterialNAT STARCH CHEM INVEST·Filed 2006·Application pending·0 cites
- 2445US2010076120A1Method of changing rheology in filled resin systems using cavitationNAT STARCH CHEM INVEST·Filed 2007·Application pending·0 cites
- 2544US2007213429A1Anisotropic conductive adhesiveCHENG CHIH-MIN·Filed 2006·Application pending·0 cites
- 2644US2005250910A1Thermal interface materialCHENG CHIH-MIN·Filed 2005·Application pending·0 cites
- 2739US2005247916A1Compositions for use in electronics devicesMCCORMICK DEMETRIUS·Filed 2004·Application pending·0 cites
- 2838US2004180209A1Thermal interface materialFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →