Inventor · disambiguated record
Chinsai T. Cheng
Also filed as: CHENG CHINSAI T
6 granted patents·1 pending application·74 citations·filing 1997–2001
84Inventor score
Top patents by PatentIndex Score
7 records- 0159US6224991B1Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such processYATES FOIL USA INC·Filed 1999·Granted May 1, 2001·14 cites·11 claims
- 0255US5989727AElectrolytic copper foil having a modified shiny sideCIRCUIT FOIL USA INC·Filed 1998·Granted Nov 23, 1999·18 cites·14 claims
- 0348US6372113B2Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing sameYATES FOIL USA INC·Filed 1999·Granted Apr 16, 2002·14 cites·6 claims
- 0448US6270648B1Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foilYATES FOIL USA INC·Filed 1999·Granted Aug 7, 2001·13 cites·9 claims
- 0540US6270645B1Simplified process for production of roughened copper foilCIRCUIT FOIL USA INC·Filed 1997·Granted Aug 7, 2001·9 cites·9 claims
- 0637US2002023844A1Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foilYATES FOIL USA INC·Filed 2001·Application pending·0 cites
- 0734US6342308B1Copper foil bonding treatment with improved bond strength and resistance to undercuttingYATES FOIL USA INC·Filed 1999·Granted Jan 29, 2002·6 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →