Inventor · disambiguated record
Chih-Kai Cheng
Also filed as: CHENG CHIH-KAI
9 granted patents·3 pending applications·14 citations·filing 2015–2024
83Inventor score
Top patents by PatentIndex Score
12 records- 0194US11923310B2Package structure including through via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 0292US12202017B2Cleaning tools and methods for cleaning the pull cable of an ingot puller apparatusGLOBALWAFERS CO LTD·Filed 2023·Granted Jan 21, 2025·4 cites·17 claims
- 0388US12491542B2Methods for cleaning the pull cable of an ingot puller apparatusGLOBALWAFERS CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·9 claims
- 0487US12491541B2Cleaning tools and methods for cleaning the pull cable of an ingot puller apparatusGLOBALWAFERS CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·12 claims
- 0587US11088079B2Package structure having line connected via portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·20 claims
- 0686US12502696B2Methods for cleaning the pull cable of an ingot puller apparatusGLOBALWAFERS CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0782US11011451B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·3 cites·20 claims
- 0875US2024363486A1Integrated circuit packages having mechanical brace standoffsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0967US12080623B2Integrated circuit packages having mechanical brace standoffsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 1062US9711478B2Semiconductor device with an anti-pad peeling structure and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·1 cites·19 claims
- 1158US2025357289A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1234US2018166715A1Fuel cell system and startup and shutdown method thereforASIA PACIFIC FUEL CELL TECH LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →