Inventor · disambiguated record
Chee Wah Cheung
Also filed as: CHEUNG CHEE WAH
22 granted patents·4 pending applications·41 citations·filing 2006–2024
92Inventor score
Files withCOMPASS TECH COMPANY LIMITED18COMPASS TECHNOLOGY CO LTD3ANALOG DEVICES INC2COMPASS TECH COMPANY LTD1COMPASS TECHNOLOGY COMPANY LTD1
Top patents by PatentIndex Score
26 records- 0189US11295891B2Electric coil structureANALOG DEVICES INC·Filed 2018·Granted Apr 5, 2022·3 cites·21 claims
- 0288US11076491B2Integrated electro-optical flexible circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted Jul 27, 2021·5 cites·22 claims
- 0388US10917973B1Method of direct embedding a lithium ion battery on a flexible printed circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2020·Granted Feb 9, 2021·3 cites·13 claims
- 0485US9360318B1Gyro MEMS sensor packageCOMPASS TECHNOLOGY COMPANY LTD·Filed 2014·Granted Jun 7, 2016·9 cites·18 claims
- 0584US10103095B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2016·Granted Oct 16, 2018·4 cites·11 claims
- 0678US7906844B2Multiple integrated circuit die package with thermal performanceCOMPASS TECHNOLOGY CO LTD·Filed 2006·Granted Mar 15, 2011·8 cites·16 claims
- 0776US10643942B2Formation of fine pitch traces using ultra-thin PAA modified fully additive processCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted May 5, 2020·0 cites·25 claims
- 0870US10923449B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Feb 16, 2021·1 cites·20 claims
- 0970US10510653B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Dec 17, 2019·1 cites·9 claims
- 1070US10468342B2Formation of fine pitch traces using ultra-thin PAA modified fully additive processCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Nov 5, 2019·1 cites·22 claims
- 1167US11749595B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1267US11553598B2Integrated electro-optical flexible circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1365US11594509B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1464US12249704B2Method of direct embedding a lithium ion battery on a flexible printed circuit boardCOMPASS TECH COMPANY LIMITED·Filed 2021·Granted Mar 11, 2025·0 cites·14 claims
- 1564US7573131B2Die-up integrated circuit package with grounded stiffenerCOMPASS TECHNOLOGY CO LTD·Filed 2006·Granted Aug 11, 2009·5 cites·26 claims
- 1663US10636734B2Formation of fine pitch traces using ultra-thin PAA modified fully additive processCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 1760US8361837B2Multiple integrated circuit die package with thermal performanceCOMPASS TECHNOLOGY CO LTD·Filed 2011·Granted Jan 29, 2013·1 cites·32 claims
- 1859US11069606B2Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnectCOMPASS TECH COMPANY LIMITED·Filed 2019·Granted Jul 20, 2021·0 cites·18 claims
- 1959US10362680B2Patterning of graphene circuits on flexible substratesCOMPASS TECH COMPANY LIMITED·Filed 2018·Granted Jul 23, 2019·0 cites·20 claims
- 2056US2025358932A1Transparent Flexible CircuitsXIAMEN COMPASS TECH CO LTD·Filed 2024·Application pending·0 cites
- 2155US9974188B2Patterning of graphene circuits on flexible substratesCOMPASS TECH COMPANY LIMITED·Filed 2016·Granted May 15, 2018·0 cites·24 claims
- 2252US2023122858A1Method of Embedding a Multi-Layer Lithium Ion Battery on a Flexible Printed Circuit BoardCOMPASS TECH COMPANY LIMITED·Filed 2021·Application pending·0 cites
- 2352US2024178124A1Embedded Die PackageCOMPASS TECH COMPANY LIMITED·Filed 2022·Application pending·0 cites
- 2451US11764392B2Battery assembly and method of manufacturing the sameANALOG DEVICES INC·Filed 2018·Granted Sep 19, 2023·0 cites·20 claims
- 2545US9637376B2Gyro MEMS sensor packageCOMPASS TECH COMPANY LTD·Filed 2016·Granted May 2, 2017·0 cites·20 claims
- 2645US2022181165A1Fabrication Method of Flexible Cyclo-Olefin Polymer (COP) Substrate for IC Packaging of Communication Devices and Biocompatible Sensors DevicesCOMPASS TECH COMPANY LIMITED·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →