Inventor · disambiguated record

Chee Hiong Chew

Also filed as: CHEW CHEE · CHEW CHEE HIONG

95 granted patents·35 pending applications·446 citations·filing 1997–2025

99Inventor score

Technology areasH10W H10P H01R H01L H05K

Files withSEMICONDUCTOR COMPONENTS IND LLC117 SEMICONDUCTOR COMPONENTS IND9 KRISHNAN SHUTESH2 MOTOROLA INC2

Top patents by PatentIndex Score

130 records

0198US11955412B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 9, 2024·8 cites·19 claims
0298US11948870B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 2, 2024·8 cites·19 claims
0398US11908840B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·8 cites·20 claims
0498US11894347B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·8 cites·20 claims
0598US11469163B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 11, 2022·8 cites·20 claims
0698US10720725B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 21, 2020·8 cites·20 claims
0796US11830856B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 28, 2023·8 cites·19 claims
0896US11452225B2Fin frame assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 20, 2022·4 cites·18 claims
0996US9620877B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Apr 11, 2017·15 cites·14 claims
1094US10199311B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 5, 2019·9 cites·13 claims
1194US9679878B1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 13, 2017·9 cites·23 claims
1292US11462515B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 4, 2022·8 cites·12 claims
1392US5973388ALeadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframeMOTOROLA INC·Filed 1999·Granted Oct 26, 1999·205 cites·7 claims
1491US2025349550A1Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1591US2025349549A1Semiconductor devices having die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1691US2025336783A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1790US9691732B2Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 27, 2017·6 cites·13 claims
1890US2025323222A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1989US11404276B2Semiconductor packages with thin die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 2, 2022·2 cites·6 claims
2089US10861767B2Package structure with multiple substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 8, 2020·6 cites·20 claims
2189US2025309199A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2288US12374555B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
2388US10319652B2Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·5 cites·9 claims
2487US12362266B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
2587US12347755B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
2687US11348878B2Reinforced semiconductor die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 31, 2022·2 cites·20 claims
2787US11342237B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 24, 2022·4 cites·5 claims
2887US10559905B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 11, 2020·3 cites·20 claims
2986US12355009B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
3086US12347812B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
3186US2025118635A1Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
3285US12374554B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
3385US11342189B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 24, 2022·1 cites·20 claims
3485US9941257B2Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Apr 10, 2018·3 cites·20 claims
3584US11532539B2Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 20, 2022·1 cites·8 claims
3684US9570832B2Press-fit pin for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Feb 14, 2017·5 cites·20 claims
3782US8268676B2Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leadsKRISHNAN SHUTESH·Filed 2010·Granted Sep 18, 2012·6 cites·18 claims
3881US2025379124A1Power circuit moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
3980US12243810B2Semiconductor package with wettable flank and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
4080US12176272B2Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
4180US2025293213A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4280US2025380369A1Stacked power terminals in a power electronics moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4379US12347813B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
4479US12040192B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
4579US7736951B2Circuit component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jun 15, 2010·11 cites·18 claims
4679US2025266305A1Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4779US2025201675A1Semiconductor package with wettable flank and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4878US10861775B2Connecting clip design for pressure sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 8, 2020·2 cites·14 claims
4978US10121763B2Clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 6, 2018·2 cites·20 claims
5078US9431311B1Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Aug 30, 2016·3 cites·6 claims

Showing the top 50 of 130 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →