Inventor · disambiguated record
Chun-Wei Chia
Also filed as: CHIA CHUN-WEI
18 granted patents·6 pending applications·8 citations·filing 2015–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24
Top patents by PatentIndex Score
24 records- 0197US11521997B2Multi-protrusion transfer gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·4 cites·20 claims
- 0294US11756842B2Daisy-chain seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 0381US12224297B2Method of forming an image sensor having stress releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0480US12170234B2Daisy-chain seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0580US10157949B2Isolation structure for reducing crosstalk between pixels and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 0679US12211862B2Multi-protrusion transfer gate manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 0779US2025185403A1Image sensor having stress releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2025062166A1Daisy-chain seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0978US12176361B2Electromagnetic radiation detection methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 1077US11837622B2Image sensor comprising polysilicon gate electrode and nitride hard maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1177US11569289B2Image sensor having stress releasing structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1277US2025176287A1Pixel sensor with multi-protrusion transfer gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1376US11569288B2Image sensor having stress releasing structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1476US2025118684A1Trench structure for reduced wafer crackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1574US12490535B2CMOS image sensor and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 1672US11444116B2Method for forming image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 1772US11164902B2Image sensor having isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 1871US10714523B2Isolation structure and image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 1967US12211805B2Trench structure for reduced wafer crackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 2064US10985199B2Image sensor having stress releasing structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2162US10879305B2Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 2255US10204960B2Method of forming polysilicon gate structure in image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 12, 2019·0 cites·20 claims
- 2355US2024006425A1Cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2453US2024274636A1Pixel sensor arrays and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →