Inventor · disambiguated record

Chin-Liang Chiang

Also filed as: CHIANG CHIN-LIANG

1 granted patent·4 citations·filing 2017–2017

23Inventor score

Technology areasH10W

Files withJING QIAO CORPORATION LTD1

Top patents by PatentIndex Score

1 record

0161US10014283B1High heat dissipation stacked chip package structure and the manufacture method thereofJING QIAO CORPORATION LTD·Filed 2017·Granted Jul 3, 2018·4 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →