Inventor · disambiguated record
Chia-Wei Chiang
Also filed as: CHIANG CHIA-WEI
5 granted patents·8 pending applications·17 citations·filing 2017–2024
73Inventor score
Top patents by PatentIndex Score
13 records- 0190US10593629B2Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 17, 2020·9 cites·20 claims
- 0283US10276510B2Manufacturing method of package structure having conductive shieldPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 0373US10607860B2Package structure and chip structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Mar 31, 2020·2 cites·11 claims
- 0472US10431549B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·2 cites·9 claims
- 0554US2025370309A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0653US2025377560A1Optical modulators for photonics devices and methods thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0752US2025237925A1Semiconductor photonics devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0851US12328907B2Semiconductor device and manufacturing method thereofAUO CORP·Filed 2022·Granted Jun 10, 2025·0 cites·16 claims
- 0951US2025264741A1Self-aligned method for forming an optical modulatorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1041US2020357770A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 1140US2020243461A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 1240US2020243449A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 1338US2020006274A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →