Inventor · disambiguated record
Ching-Wen Chiang
Also filed as: CHIANG CHING-WEN
21 granted patents·4 pending applications·78 citations·filing 2013–2023
93Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD15NAT CHUNG SHAN INST SCIENCE & TECH7IND TECH RES INST3
Top patents by PatentIndex Score
25 records- 0197US10096558B1Multi-band antenna package structure, manufacturing method thereof and communication deviceNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Oct 9, 2018·36 cites·15 claims
- 0291US9818683B2Electronic package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 14, 2017·9 cites·12 claims
- 0389US9754868B2Substrate structure, electronic package and method for fabricating the electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Sep 5, 2017·8 cites·6 claims
- 0488US10424550B2Multi-band antenna package structure, manufacturing method thereof and communication deviceNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Sep 24, 2019·5 cites·11 claims
- 0587US10566299B2Method for manufacturing a multi-band antenna package structureNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2019·Granted Feb 18, 2020·4 cites·5 claims
- 0685US10199320B2Method of fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 5, 2019·4 cites·13 claims
- 0783US10886593B2Structure of integrated radio frequency multi-chip package and method of fabricating the sameIND TECH RES INST·Filed 2018·Granted Jan 5, 2021·4 cites·20 claims
- 0879US9899344B2Substrate structure, fabrication method thereof and conductive structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 20, 2018·3 cites·7 claims
- 0973US10298182B1Radio frequency amplifier and integrated circuit using the radio frequency amplifierNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted May 21, 2019·2 cites·8 claims
- 1069US10361154B2Variable inductor and integrated circuit using the variable inductorNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Jul 23, 2019·1 cites·8 claims
- 1165US10277170B1Radio frequency amplifier and integrated circuit using the radio frequency amplifierNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Apr 30, 2019·1 cites·8 claims
- 1262US9627307B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Apr 18, 2017·1 cites·10 claims
- 1353US12374794B2Antenna-in-package construction with frequency division duplex technologyIND TECH RES INST·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 1452US10707835B1Wireless receiving deviceIND TECH RES INST·Filed 2018·Granted Jul 7, 2020·0 cites·6 claims
- 1552US10199345B2Method of fabricating substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 5, 2019·0 cites·5 claims
- 1652US10096541B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 9, 2018·0 cites·9 claims
- 1751US9748183B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Aug 29, 2017·0 cites·11 claims
- 1846US9196596B2Interposer and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 24, 2015·0 cites·17 claims
- 1942US2019189342A1Variable inductor and integrated circuit using the variable inductorNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Application pending·0 cites
- 2041US10049973B2Electronic package and fabrication method thereof and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 14, 2018·0 cites·10 claims
- 2139US10249562B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Apr 2, 2019·0 cites·20 claims
- 2234US2016049359A1Interposer with conductive post and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2334US2016148873A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2433US2016086903A1Semiconductor structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2530US10236227B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 19, 2019·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →