Inventor · disambiguated record
Chin-Her Chien
Also filed as: CHIEN CHIN-HER
24 granted patents·6 pending applications·24 citations·filing 2013–2024
93Inventor score
Top patents by PatentIndex Score
30 records- 0191US11222884B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·5 cites·20 claims
- 0290US11387177B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 12, 2022·8 cites·20 claims
- 0389US11756951B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·1 cites·20 claims
- 0484US2024413052A1Heat Dissipation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0583US12154842B2Heat dissipation structures for three-dimensional system on integrated chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0683US11094608B2Heat dissipation structure including stacked chips surrounded by thermal interface material ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 0783US9269640B2Repairing monolithic stacked integrated circuits with a redundant layer and lithography processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·5 cites·16 claims
- 0882US12027513B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 0982US2024312978A1Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1082US2024386183A1Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1180US12223252B2Through-silicon via in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1275US11749584B2Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1375US11715668B2Integrated antenna on interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 1474US9779990B2Integrated antenna on interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 3, 2017·2 cites·20 claims
- 1573US11586797B2Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 1672US11075116B2Integrated antenna on interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 1766US8981842B1Integrated circuit comprising buffer chainTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 17, 2015·1 cites·20 claims
- 1865US2022320018A1Interposer with capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1962US10949597B2Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 2062US10692763B2Integrated antenna on interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 2162US2022246509A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2262US2022375827A1Soic chip architectureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2359US10163708B2Integrated antenna on interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 2454US11367695B2Interposer with capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 21, 2022·0 cites·20 claims
- 2552US9601478B2Oxide definition (OD) gradient reduced semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 21, 2017·0 cites·20 claims
- 2652US9286431B2Oxide definition (OD) gradient reduced semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 2751US9478469B2Integrated circuit comprising buffer chainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·0 cites·20 claims
- 2849US12424515B2SOIC chip architectureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 23, 2025·0 cites·21 claims
- 2949US9847318B2Monolithic stacked integrated circuits with a redundant layer for repairing defectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 19, 2017·0 cites·20 claims
- 3048US11211333B2Through silicon via optimization for three-dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →