Inventor · disambiguated record
Chen-Nan Chiu
Also filed as: CHIU CHEN-NAN
2 granted patents·6 pending applications·0 citations·filing 2020–2025
25Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0170US2025309171A1Semiconductor package with ball grid array connection having improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0264US12362307B2Semiconductor package with ball grid array connection having improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0356US2025118697A1Package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0454US2025118615A1Package structure including a heat dissipation structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0551US11342291B2Semiconductor packages with crack preventing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 0651US2025038043A1Dendrite mitigation of passive componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0750US2025246567A1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0848US2024395750A1Three-Dimensional Integrated Circuit with Hybrid Bond Metal StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →