Inventor · disambiguated record
Chien-Chia Chiu
Also filed as: CHIU CHIEN-CHIA
20 granted patents·8 pending applications·210 citations·filing 1999–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22IND TECH RES INST2ADVANCED CHIP ENG TECH INC1AVISION INC1YU CHEN-HUA1
Top patents by PatentIndex Score
28 records- 0195US9972581B1Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 15, 2018·14 cites·20 claims
- 0294US11515229B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·20 claims
- 0394US6614172B2High efficiency white light emitting diodeIND TECH RES INST·Filed 2000·Granted Sep 2, 2003·137 cites·23 claims
- 0493US10354961B2Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·8 cites·20 claims
- 0588US11581268B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 0685US10068867B2Post-passivation interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·4 cites·20 claims
- 0784US12506087B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0881US2025087550A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0980US11955439B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1080US2025105090A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1178US12125757B2Semiconductor package with stiffener structure and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1278US2025357367A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1376US12191224B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1473US11031352B2Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 1571US8557631B2Interposer wafer bonding method and apparatusYU CHEN-HUA·Filed 2011·Granted Oct 15, 2013·3 cites·13 claims
- 1670US11721602B2Semiconductor package with stiffener structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 1769US12205866B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 1868US6373875B1Semiconductor laser structure with an increased catastrophic optical damage levelIND TECH RES INST·Filed 1999·Granted Apr 16, 2002·38 cites·14 claims
- 1962US9941216B2Conductive pattern and integrated fan-out package having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·1 cites·17 claims
- 2060US10971425B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 2159US2025058988A1Silent one-way clutch assembly and document scanner using the sameAVISION INC·Filed 2024·Application pending·0 cites
- 2258US2025357289A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2354US11195802B2Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 2454US2024178086A1Package, package structure and method of manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2549US9818711B2Post-passivation interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·0 cites·20 claims
- 2640US9748212B2Shadow pad for post-passivation interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
- 2739US2008142941A13d electronic packaging structure with enhanced grounding performance and embedded antennaADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 2825US2002036286A1Gallium nitride based II-V group compound semiconductor deviceFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →