Inventor · disambiguated record
Chi-Hao Chiu
Also filed as: CHIU CHI-HAO
24 granted patents·9 pending applications·168 citations·filing 2004–2015
94Inventor score
Files withADVANCED SEMICONDUCTOR ENG10APAQ TECHNOLOGY CO LTD10CHIU CHI-HAO7LIN CHING FENG2FRAN YUI-SHIN1
Top patents by PatentIndex Score
33 records- 0189US6967403B2Package structure with a heat spreader and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Nov 22, 2005·72 cites·14 claims
- 0280US7163840B2Flip chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 16, 2007·25 cites·9 claims
- 0378US8164883B2Stacked solid electrolytic capacitor and a method for manufacturing the sameCHIU CHI-HAO·Filed 2010·Granted Apr 24, 2012·4 cites·28 claims
- 0476US7253508B2Semiconductor package with a flip chip on a solder-resist leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·24 cites·14 claims
- 0573US9159490B2Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unitAPAQ TECHNOLOGY CO LTD·Filed 2014·Granted Oct 13, 2015·2 cites·10 claims
- 0672US8654511B2Capacitance unit and stacked solid electrolytic capacitorCHIU CHI-HAO·Filed 2011·Granted Feb 18, 2014·2 cites·9 claims
- 0771US7164202B2Quad flat flip chip package and leadframe thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 16, 2007·17 cites·13 claims
- 0868US8373972B2Solid electrolytic capacitor having a protective structure and method for manufacturing the sameAPAQ TECHNOLOGY CO LTD·Filed 2010·Granted Feb 12, 2013·1 cites·9 claims
- 0964US7067904B2Flip-chip type quad flat package and leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 27, 2006·11 cites·12 claims
- 1059US7404663B2Backlight moduleHANNSTAR DISPLAY CORP·Filed 2005·Granted Jul 29, 2008·1 cites·8 claims
- 1158US7138900B2Resetable over-current protection device and method of making the sameINPAQ TECHNOLOGY CO LTD·Filed 2004·Granted Nov 21, 2006·5 cites·14 claims
- 1254US2014078647A1Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the sameCHIU CHI-HAO·Filed 2012·Application pending·0 cites
- 1352US9105398B2Method of manufacturing a stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pinsAPAQ TECHNOLOGY CO LTD·Filed 2015·Granted Aug 11, 2015·0 cites·5 claims
- 1448US2007085218A1Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1546US7022551B2Quad flat flip chip packaging process and leadframe thereforADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 4, 2006·2 cites·12 claims
- 1644US8787002B2Winding-type solid electrolytic capacitor package structureLIN CHING-FENG·Filed 2012·Granted Jul 22, 2014·0 cites·10 claims
- 1744US8755171B2Stacked-type solid electrolytic capacitor package structureLIN CHING-FENG·Filed 2012·Granted Jun 17, 2014·0 cites·10 claims
- 1842US9754729B2Solid-state electrolytic capacitor with improved metallic anode and method for manufacturing the sameAPAQ TECHNOLOGY CO LTD·Filed 2015·Granted Sep 5, 2017·0 cites·8 claims
- 1942US8369066B2Lamellar stacked solid electrolytic capacitorAPAQ TECHNOLOGY CO LTD·Filed 2010·Granted Feb 5, 2013·0 cites·12 claims
- 2042US2014307365A1Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the sameAPAQ TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2142US2013258555A1Capacitor unit and stacked solid electrolytic capacitor having the sameCHIU CHI-HAO·Filed 2012·Application pending·0 cites
- 2241US9824827B2Method for making solid electrolytic capacitor package structure with improved conductive terminalsAPAQ TECHNOLOGY CO LTD·Filed 2015·Granted Nov 21, 2017·0 cites·6 claims
- 2341US8390991B2Stacked solid-state electrolytic capacitor with multi-directional product lead frame structureCHIU CHI-HAO·Filed 2010·Granted Mar 5, 2013·0 cites·14 claims
- 2441US8305734B2Insulating encapsulation structure for solid chip electrolytic capacitorCHIU CHI-HAO·Filed 2010·Granted Nov 6, 2012·0 cites·8 claims
- 2540US8310814B2Stacked capacitor with positive multi-pin structureCHIU CHI-HAO·Filed 2009·Granted Nov 13, 2012·0 cites·14 claims
- 2640US6929980B2Manufacturing method of flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 16, 2005·2 cites·11 claims
- 2738US8305735B2Stacked solid electrolytic capacitor with multi-pin structureFRAN YUI-SHIN·Filed 2009·Granted Nov 6, 2012·0 cites·10 claims
- 2838US2004212097A1Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2938US2004212069A1Multi-chips stacked packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 3036US2016343512A1Matrix arrangement stacked-type solid electrolytic capacitor package structure and method of manufacturing the sameAPAQ TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 3133US9741496B2Stacked-type solid electrolytic capacitor package structure and method of manufacturing the sameAPAQ TECHNOLOGY CO LTD·Filed 2015·Granted Aug 22, 2017·0 cites·10 claims
- 3232US2016240327A1Capacitor unit with high-energy storageAPAQ TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 3328US2005146050A1Flip chip package structure and chip structure thereofFiled 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chi-Hao Chiu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →