Inventor · disambiguated record

Chih-Hsien Chiu

Also filed as: CHIU CHIH-HSIEN

59 granted patents·33 pending applications·106 citations·filing 2006–2025

98Inventor score

Technology areasH10W H01Q H05K H01L C07K

Files withSILICONWARE PRECISION INDUSTRIES CO LTD82 CHEN CHING-HUA1 CHIU CHIH-HSIEN1 CHROMA ATE INC1 LI KUAN-HSING1

Top patents by PatentIndex Score

92 records

0196US12068535B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 20, 2024·4 cites·37 claims
0295US11195808B2Electronic package having antenna function and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 7, 2021·5 cites·13 claims
0394US10410970B1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 10, 2019·13 cites·19 claims
0493US11594501B2Fabrication method of electronic package having antenna functionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Feb 28, 2023·2 cites·14 claims
0593US10916526B2Method for fabricating electronic package with conductive pillarsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Feb 9, 2021·4 cites·11 claims
0688US8912959B2Packaging structure and method of fabricating the sameCHIU CHIH-HSIEN·Filed 2012·Granted Dec 16, 2014·16 cites·22 claims
0787US11222852B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jan 11, 2022·4 cites·6 claims
0886US12057409B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 6, 2024·1 cites·22 claims
0984US12224255B2Electronic package including lead frame having multiple conductive postsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·14 claims
1084US9907186B1Electronic package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·6 cites·23 claims
1183US12438266B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·39 claims
1283US11587892B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·10 claims
1382US10461041B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 29, 2019·3 cites·10 claims
1479US12230590B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·10 claims
1579US11984412B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted May 14, 2024·0 cites·10 claims
1679US11973043B2Multiple conductive postsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·13 claims
1779US9673151B2Semiconductor package having metal layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·10 claims
1879US9508656B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·8 claims
1979US8059416B2Multi-cavity electromagnetic shielding deviceLI KUAN-HSING·Filed 2008·Granted Nov 15, 2011·13 cites·12 claims
2077US9111945B2Package having ESD and EMI preventing functions and fabrication method thereofTSAI TSUNG-HSIEN·Filed 2011·Granted Aug 18, 2015·4 cites·12 claims
2176US11532568B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 20, 2022·1 cites·6 claims
2276US7319429B2Partially reflective surface antennaTATUNG CO·Filed 2006·Granted Jan 15, 2008·10 cites·13 claims
2375US2025132273A1Electronic package including lead frame having multiple conductive postsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
2474US2025149471A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
2573US12100641B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·26 claims
2673US9221873B1Short-chain peptide capable of controlling spermatozoa fertilization performanceUNIV NAT TAIWAN·Filed 2014·Granted Dec 29, 2015·2 cites·7 claims
2772US10833394B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Nov 10, 2020·1 cites·32 claims
2872US2025125237A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
2971US12500131B2Electronic package including an interposer stacked on an electronic element and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·16 claims
3071US2024297126A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
3169US10199317B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·2 cites·18 claims
3267US10643974B2Electronic package with conductive pillarsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted May 5, 2020·1 cites·5 claims
3367US10230152B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 12, 2019·2 cites·8 claims
3466US12476229B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·11 claims
3566US9899335B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·1 cites·7 claims
3665US12211776B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·17 claims
3765US11749583B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·30 claims
3865US10587041B2Electronic package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 10, 2020·1 cites·27 claims
3963US10818515B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Oct 27, 2020·1 cites·20 claims
4062US2023082767A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
4161US11476572B2Method for fabricating electronic package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·23 claims
4260US2025226326A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
4360US2025183109A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
4459US2025293424A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
4558US12500181B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
4658US2025293115A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
4757US8618655B2Carrier-free semiconductor packageCHEN CHING-HUA·Filed 2011·Granted Dec 31, 2013·1 cites·7 claims
4857US2025385230A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
4957US2025096153A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
5057US2025022809A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites

Showing the top 50 of 92 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →