Inventor · disambiguated record
Chih-Yuan Chiu
Also filed as: CHIU CHIH-YUAN
5 granted patents·10 pending applications·2 citations·filing 2014–2025
64Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15
Top patents by PatentIndex Score
15 records- 0191US12009337B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 0283US2025357418A1Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0380US12438118B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0470US12506109B2Die bonding tool with tiltable bond head for improved bonding and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0560US2025367865A1Die ejector having independently engaged ejector rods, method of performing die pick-up with the die ejector, and die ejector system including the die ejectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025391810A1Systems for optical oxide detection in semiconductor devices and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0756US2024404839A1Wire bonding using in-situ plasma treatment and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0855US12362317B2Semiconductor die dipping structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0955US2025062274A1Bonding apparatus and method of manufacturing an integrated circuit package using the apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1055US2024404989A1Parallel plasma treatment and thermocompression bonding and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1155US2025054786A1Die bonding tool with movable component for improved die protrusion control and methods for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1255US2025132284A1Die bonding tool with tiltable bond stage and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1355US2024404988A1Fluxless die bonding using in-situ plasma treatment and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1454US2025006690A1Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1540US10312118B2Bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 4, 2019·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Chih-Yuan Chiu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →