Inventor · disambiguated record
Chia-Pin Chiu
Also filed as: CHIU CHIA-PIN
118 granted patents·44 pending applications·2,394 citations·filing 1994–2025
99Inventor score
Top patents by PatentIndex Score
162 records- 0199US9349703B2Method for making high density substrate interconnect using inkjet printingINTEL CORP·Filed 2013·Granted May 24, 2016·111 cites·10 claims
- 0299US9269701B2Localized high density substrate routingINTEL CORP·Filed 2015·Granted Feb 23, 2016·49 cites·20 claims
- 0399US9190380B2High density substrate routing in BBUL packageINTEL CORP·Filed 2012·Granted Nov 17, 2015·64 cites·17 claims
- 0499US9171816B2High density substrate routing in BBUL packageINTEL CORP·Filed 2015·Granted Oct 27, 2015·53 cites·17 claims
- 0598US9741664B2High density substrate interconnect formed through inkjet printingINTEL CORP·Filed 2016·Granted Aug 22, 2017·32 cites·20 claims
- 0698US9437569B2High density substrate routing in BBUL packageINTEL CORP·Filed 2015·Granted Sep 6, 2016·23 cites·20 claims
- 0798US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0898US6580611B1Dual-sided heat removal systemINTEL CORP·Filed 2002·Granted Jun 17, 2003·176 cites·31 claims
- 0997US10199346B2High density substrate routing in packageINTEL CORP·Filed 2018·Granted Feb 5, 2019·12 cites·20 claims
- 1097US9929119B2High density substrate routing in BBUL packageINTEL CORP·Filed 2016·Granted Mar 27, 2018·11 cites·20 claims
- 1197US9679843B2Localized high density substrate routingINTEL CORP·Filed 2016·Granted Jun 13, 2017·17 cites·20 claims
- 1297US9275971B2Bridge interconnect with air gap in package assemblyINTEL CORP·Filed 2014·Granted Mar 1, 2016·33 cites·21 claims
- 1397US9153552B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2014·Granted Oct 6, 2015·43 cites·8 claims
- 1497US8912670B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2012·Granted Dec 16, 2014·53 cites·10 claims
- 1597US8872349B2Bridge interconnect with air gap in package assemblyCHIU CHIA-PIN·Filed 2012·Granted Oct 28, 2014·83 cites·24 claims
- 1696US9136236B2Localized high density substrate routingSTARKSTON ROBERT·Filed 2012·Granted Sep 15, 2015·69 cites·16 claims
- 1796US7259965B2Integrated circuit coolant microchannel assembly with targeted channel configurationINTEL CORP·Filed 2005·Granted Aug 21, 2007·40 cites·14 claims
- 1895US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 1995US10320051B2Heat sink for 5G massive antenna array and methods of assembling sameINTEL CORP·Filed 2017·Granted Jun 11, 2019·14 cites·22 claims
- 2095US7511372B2Microelectronic die cooling device including bonding posts and method of forming sameINTEL CORP·Filed 2005·Granted Mar 31, 2009·38 cites·17 claims
- 2194US10366951B2Localized high density substrate routingINTEL CORP·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 2294US9520376B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2015·Granted Dec 13, 2016·11 cites·7 claims
- 2394US9159690B2Tall solders for through-mold interconnectINTEL CORP·Filed 2013·Granted Oct 13, 2015·42 cites·10 claims
- 2494US6869825B2Folded BGA package design with shortened communication paths and more electrical routing flexibilityINTEL CORP·Filed 2002·Granted Mar 22, 2005·91 cites·20 claims
- 2594US6841855B2Electronic package having a flexible substrate with ends connected to one anotherINTEL CORP·Filed 2003·Granted Jan 11, 2005·78 cites·22 claims
- 2693US11515248B2Localized high density substrate routingINTEL CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 2793US9875969B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2012·Granted Jan 23, 2018·12 cites·6 claims
- 2892US7851905B2Microelectronic package and method of cooling an interconnect feature in sameINTEL CORP·Filed 2007·Granted Dec 14, 2010·40 cites·16 claims
- 2991US12327807B2High density substrate routing in packageINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 3091US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 3191US10923429B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2020·Granted Feb 16, 2021·2 cites·20 claims
- 3291US10510669B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2018·Granted Dec 17, 2019·4 cites·7 claims
- 3391US2025323204A1High density substrate routing in packageINTEL CORP·Filed 2025·Application pending·0 cites
- 3491US2025323203A1High density substrate routing in packageINTEL CORP·Filed 2025·Application pending·0 cites
- 3591US2024421073A1Localized high density substrate routingINTEL CORP·Filed 2024·Application pending·0 cites
- 3691US2025323145A1Localized high density substrate routingINTEL CORP·Filed 2025·Application pending·0 cites
- 3790US9666549B2Methods for solder for through-mold interconnectINTEL CORP·Filed 2015·Granted May 30, 2017·10 cites·16 claims
- 3890US7251139B2Thermal management arrangement for standardized peripheralsINTEL CORP·Filed 2003·Granted Jul 31, 2007·53 cites·19 claims
- 3990US6651736B2Short carbon fiber enhanced thermal greaseINTEL CORP·Filed 2001·Granted Nov 25, 2003·65 cites·13 claims
- 4090US5513070ADissipation of heat through keyboard using a heat pipeINTEL CORP·Filed 1994·Granted Apr 30, 1996·161 cites·19 claims
- 4189US7312527B2Low temperature phase change thermal interface material damINTEL CORP·Filed 2005·Granted Dec 25, 2007·18 cites·22 claims
- 4289US2024429173A1Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2024·Application pending·0 cites
- 4388US9241423B2Fluid-cooled heat dissipation deviceINTEL CORP·Filed 2013·Granted Jan 19, 2016·9 cites·30 claims
- 4488US7566228B2Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skivingINTEL CORP·Filed 2007·Granted Jul 28, 2009·14 cites·14 claims
- 4588US6523608B1Thermal interface material on a mesh carrierINTEL CORP·Filed 2000·Granted Feb 25, 2003·68 cites·22 claims
- 4688US6519154B1Thermal bus design to cool a microelectronic dieINTEL CORP·Filed 2001·Granted Feb 11, 2003·51 cites·22 claims
- 4788US2025323202A1High density substrate routing in packageINTEL CORP·Filed 2025·Application pending·0 cites
- 4887US12051667B2High density substrate routing in packageINTEL CORP·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 4987US7755186B2Cooling solutions for die-down integrated circuit packagesINTEL CORP·Filed 2007·Granted Jul 13, 2010·14 cites·6 claims
- 5086US12113026B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
Showing the top 50 of 162 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chia-Pin Chiu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →