Inventor · disambiguated record
Chih-Pin Chiu
Also filed as: CHIU CHIH-PIN
8 granted patents·13 pending applications·2 citations·filing 2014–2025
74Inventor score
Top patents by PatentIndex Score
21 records- 0187US12494422B2Semiconductor structure and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·1 cites·20 claims
- 0280US2025321264A1Wafer test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US2025364375A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US2025364397A1Semiconductor packaging structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0576US2025357274A1Through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US2025336858A1Methods of forming metal ion barrier layers and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US2025336751A1Heat dissipating structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0874US2025357211A1Through via structure and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0973US12399210B2Wafer test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1073US2025364322A1Redistribution layer and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1170US2025210462A1Through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1269US2025336770A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1369US2025046667A1Heat Dissipating Structure and Methods of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1468US2024355766A1Methods of forming metal ion barrier layers and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1566US12512433B2Semiconductor structures and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1665US9791387B2Inspection system and method for controlling the sameTEST RESEARCH INC·Filed 2014·Granted Oct 17, 2017·1 cites·18 claims
- 1764US2024312840A1Through via structure and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1863US12417973B2Semiconductor packaging structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1961US11761912B2X-ray security deviceDELTA ELECTRONICS INC·Filed 2022·Granted Sep 19, 2023·0 cites·15 claims
- 2058US12310252B2Semiconductor memory structure and method for forming the semiconductor memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 2150US12010924B2Method for manufacturing semiconductor structure with memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →