Inventor · disambiguated record
Chao-Shun Chiu
Also filed as: CHIU CHAO-SHUN
1 granted patent·2 pending applications·11 citations·filing 2006–2015
33Inventor score
Top patents by PatentIndex Score
3 records- 0187US9379043B1TSV structure having insulating layers with embedded voidsPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Jun 28, 2016·11 cites·10 claims
- 0236US2007170147A1Etching method and method of fabricating openingLIN YI-HSIUNG·Filed 2006·Application pending·0 cites
- 0331US2015048496A1Fabrication process and structure to form bumps aligned on tsv on chip backsideMACROTECH TECHNOLOGY INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →