Inventor · disambiguated record
Chee Chiew Chong
Also filed as: CHONG CHEE CHIEW
1 granted patent·2 pending applications·0 citations·filing 2020–2023
7Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0149US2024312956A1Subtractive Metal Structuring on Surface of Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0242US11239127B2Topside-cooled semiconductor package with molded standoffINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0340US2021313294A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →