Inventor · disambiguated record
Chin Mian Choong
Also filed as: CHOONG CHIN MIAN
0 granted patents·3 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0157US2025096154A1Package Substrates with Stiffener InterposersINTEL CORP·Filed 2023·Application pending·0 cites
- 0255US2025107003A1Methods and apparatus to manage noise for timing circuitryINTEL CORP·Filed 2023·Application pending·0 cites
- 0353US2024106139A1Connector to electrically couple multiple substratesINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →