Inventor · disambiguated record
Che-Ya Chou
Also filed as: CHOU CHE-YA
28 granted patents·11 pending applications·193 citations·filing 2004–2022
95Inventor score
Top patents by PatentIndex Score
39 records- 0198US7550836B2Structure of package on package and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 23, 2009·130 cites·18 claims
- 0292US10847869B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·9 cites·23 claims
- 0392US10636773B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Apr 28, 2020·11 cites·19 claims
- 0490US11373957B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2020·Granted Jun 28, 2022·2 cites·12 claims
- 0588US9165877B2Fan-out semiconductor package with copper pillar bumpsMEDIATEK INC·Filed 2013·Granted Oct 20, 2015·8 cites·13 claims
- 0681US10991669B2Semiconductor package using flip-chip technologyMEDIATEK INC·Filed 2016·Granted Apr 27, 2021·3 cites·23 claims
- 0780US11728292B2Semiconductor package assembly having a conductive electromagnetic shield layerMEDIATEK INC·Filed 2020·Granted Aug 15, 2023·1 cites·18 claims
- 0880US10784206B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·2 cites·17 claims
- 0978US10515887B2Fan-out package structure having stacked carrier substrates and method for forming the sameMEDIATEK INC·Filed 2017·Granted Dec 24, 2019·3 cites·23 claims
- 1077US10103128B2Semiconductor package incorporating redistribution layer interposerMEDIATEK INC·Filed 2017·Granted Oct 16, 2018·3 cites·19 claims
- 1175US11837552B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2022·Granted Dec 5, 2023·0 cites·19 claims
- 1275US9818727B2Semiconductor package assembly with passive deviceMEDIATEK INC·Filed 2016·Granted Nov 14, 2017·2 cites·38 claims
- 1375US9064757B2Enhanced flip chip structure using copper column interconnectGREGORICH THOMAS MATTHEW·Filed 2012·Granted Jun 23, 2015·4 cites·7 claims
- 1474US9704808B2Semiconductor device and wafer level package including such semiconductor deviceMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·2 cites·26 claims
- 1573US10128192B2Fan-out package structureMEDIATEK INC·Filed 2017·Granted Nov 13, 2018·2 cites·15 claims
- 1669US10199318B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Feb 5, 2019·1 cites·28 claims
- 1769US10147674B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Dec 4, 2018·1 cites·24 claims
- 1868US10224287B2Semiconductor device and wafer level package including such semiconductor deviceMEDIATEK INC·Filed 2017·Granted Mar 5, 2019·1 cites·17 claims
- 1968US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 2066US7193282B2Contact sensor packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 20, 2007·3 cites·9 claims
- 2165US11908759B2Semiconductor deviceMEDIATEK INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 2264US11721882B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 2357US10468341B2Semiconductor package assemblyMEDIATEK INC·Filed 2018·Granted Nov 5, 2019·0 cites·28 claims
- 2453US10497678B2Semiconductor package assembly with passive deviceMEDIATEK INC·Filed 2017·Granted Dec 3, 2019·0 cites·2 claims
- 2549US11244913B2Semiconductor packageMEDIATEK INC·Filed 2019·Granted Feb 8, 2022·0 cites·19 claims
- 2649US2018102298A1Semiconductor deviceMEDIATEK INC·Filed 2017·Application pending·0 cites
- 2748US9704792B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·0 cites·20 claims
- 2848US2017040266A1Fan-out package structure including antennaMEDIATEK INC·Filed 2016·Application pending·0 cites
- 2945US2016005726A1System-in-packageMEDIATEK INC·Filed 2015·Application pending·0 cites
- 3044US2008116556A1Package structure having through hole in spacer thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 3143US2008122059A1Stacked chip package structure and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 3242US2014042615A1Flip-chip packageMEDIATEK INC·Filed 2013·Application pending·0 cites
- 3341US9437534B2Enhanced flip chip structure using copper column interconnectMEDIATEK INC·Filed 2015·Granted Sep 6, 2016·0 cites·7 claims
- 3441US2008044931A1Packaging substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 3541US2019355697A1Electronic package for high-data rate communication applicationsMEDIATEK INC·Filed 2019·Application pending·0 cites
- 3639US10074628B2System-in-package and fabrication method thereofMEDIATEK INC·Filed 2016·Granted Sep 11, 2018·0 cites·12 claims
- 3738US2005139997A1Chip assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 3837US2018053665A1Pre-bumped redistribution layer structure and semiconductor package incorporating such pre-bumped redistribution layer structureMEDIATEK INC·Filed 2017·Application pending·0 cites
- 3929US2016307873A1Bonding pad arrangment design for semiconductor packageMEDIATEK INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →