Inventor · disambiguated record
Chia-Cheng Chou
Also filed as: CHOU CHIA-CHENG
45 granted patents·9 pending applications·151 citations·filing 2005–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD29TAIWAN SEMICONDUCTOR MFG13KO CHUNG-CHI5SINGTEX IND CO LTD2CHI HUA FITNESS CO LTD1
Top patents by PatentIndex Score
54 records- 0198US10163691B2Low-K dielectric interconnect systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·36 cites·20 claims
- 0297US9754822B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·30 cites·20 claims
- 0396US9679804B1Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·19 cites·20 claims
- 0495US11929281B2Reducing oxidation by etching sacrificial and protection layer separatelyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0594US11929329B2Damascene process using cap layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 12, 2024·3 cites·20 claims
- 0691US2025357108A1Low-k dielectric and processes for forming same forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0789US10707165B2Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 7, 2020·4 cites·20 claims
- 0888US10269627B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 0988US9768061B1Low-k dielectric interconnect systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·4 cites·20 claims
- 1087US10840134B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·3 cites·20 claims
- 1185US2025329582A1Reducing oxidation by etching sacrificial and protection layer separatelyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1283US12255138B2Interconnect structures of semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1383US7968451B2Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnectionsTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 28, 2011·8 cites·21 claims
- 1483US7723226B2Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratioTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 25, 2010·11 cites·19 claims
- 1583US2024371769A1Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1679US12062613B2Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 1779US7314828B2Repairing method for low-k dielectric materialsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 1, 2008·6 cites·16 claims
- 1879US2025192030A1Interconnect structures of semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1978US11923294B2Interconnect structures of semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 2077US11049763B2Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·1 cites·20 claims
- 2177US2024178059A1Reducing oxidation by etching sacrificial and protection layer separatelyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2273US12424438B2Low-k dielectric and processes for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 2372US11417602B2Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 2472US7466027B2Interconnect structures with surfaces roughness improving liner and methods for fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 16, 2008·5 cites·21 claims
- 2571US12492493B2Woven brushed elastic fabric and method of making the sameSINGTEX IND CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·15 claims
- 2671US11373947B2Methods of forming interconnect structures of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 2771US11328952B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 2871US9981153B2Brake controller for spinner bikeCHI HUA FITNESS CO LTD·Filed 2016·Granted May 29, 2018·3 cites·10 claims
- 2970US9589856B2Automatically adjusting baking process for low-k dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·1 cites·20 claims
- 3070US8043959B2Method of forming a low-k dielectric layer with improved damage resistance and chemical integrityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 25, 2011·3 cites·21 claims
- 3170US7485949B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 3, 2009·4 cites·17 claims
- 3269US9257331B2Method of making interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·1 cites·20 claims
- 3367US11062901B2Low-k dielectric and processes for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 3466US9236294B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 12, 2016·1 cites·20 claims
- 3565US8481412B2Method of and apparatus for active energy assist bakingKO CHUNG-CHI·Filed 2010·Granted Jul 9, 2013·1 cites·20 claims
- 3664US8993442B2Interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·1 cites·20 claims
- 3762US10910216B2Low-k dielectric and processes for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 2, 2021·0 cites·20 claims
- 3857US10510585B2Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
- 3956US9748134B2Method of making interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·0 cites·20 claims
- 4056US9004914B2Method of and apparatus for active energy assist bakingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·0 cites·20 claims
- 4154US8853831B2Interconnect structure and method for forming the sameSHIH PO-CHENG·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
- 4254US7998873B2Method for fabricating low-k dielectric and Cu interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 16, 2011·0 cites·20 claims
- 4354US2018209079A1Woven brushed elastic fabric and method of making the sameSINGTEX IND CO LTD·Filed 2018·Application pending·0 cites
- 4453US2023154765A1Oxygen-Free Protection Layer Formation in Wafer Bonding ProcessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4551US8629056B2Method for forming self-assembled mono-layer liner for cu/porous low-k interconnectionsKO CHUNG-CHI·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
- 4651US8354346B2Method for fabricating low-k dielectric and Cu interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Jan 15, 2013·0 cites·16 claims
- 4750US9373581B2Interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·0 cites·20 claims
- 4850US8877083B2Surface treatment in the formation of interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 4, 2014·0 cites·20 claims
- 4948US2007278682A1Self-assembled mono-layer liner for cu/porous low-k interconnectionsKO CHUNG-CHI·Filed 2006·Application pending·0 cites
- 5047US2009258487A1Method for Improving the Reliability of Low-k Dielectric MaterialsLIN KENG-CHU·Filed 2008·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →