Inventor · disambiguated record
Ching-Sheng Chu
Also filed as: CHU CHING-SHENG
12 granted patents·2 pending applications·18 citations·filing 2014–2024
86Inventor score
Top patents by PatentIndex Score
14 records- 0193US11264368B2Mask transfer method (and related apparatus) for a bumping processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·3 cites·20 claims
- 0292US12154939B2High capacitance MIM device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·1 cites·20 claims
- 0389US9257498B1Process to improve performance for metal-insulator-metal (MIM) capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 9, 2016·9 cites·20 claims
- 0483US11211352B2Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·3 cites·20 claims
- 0577US12132039B2Mask transfer method (and related apparatus) for a bumping processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 0677US2024387613A1Capacitor device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0776US12087826B2Method for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0872US11721683B2Mask transfer method (and related apparatus) for a bumping processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 0971US9793339B2Method for preventing copper contamination in metal-insulator-metal (MIM) capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·2 cites·19 claims
- 1070US11735550B2Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1169US11476337B2Method for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1267US11769791B2High capacitance MIM device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 1359US10790362B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·20 claims
- 1459US2025218793A1Semiconductor die and methods of formationTAIWAN SEMICONDUCTOR MANUFACTACTURING COMPANY LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →